Table of Contents
1. File integrity check
Confirm that the Gerber file contains all necessary layers, such as top layer, bottom layer, silk screen layer, solder mask layer, drilling file, etc. The naming of Gerber files generated by different PCB design software may vary, but there is usually a certain pattern. For example, the Gerber file generated by Altium Designer may have the top copper foil named “GTL” and the bottom copper foil named “GBL”. Ensure that no key layer files are overlooked.
2. Layer alignment check
Use professional Gerber viewing software such as CAM350 to import files from each layer and perform layer alignment checks. In an ideal situation, the graphics of each layer should be precisely aligned, especially key elements such as solder pads and vias. If there is an offset between layers, it may cause the produced PCB to not function properly.
3. Drilling inspection
Check if the drilling positions and sizes in the drilling file are correct. Confirm that all locations requiring drilling have corresponding drilling information, and that the diameter of the drilling meets the design requirements. At the same time, check whether there is sufficient distance between the drill hole and the surrounding copper foil, wiring, etc. to avoid short circuits or other electrical problems.
4. Copper foil circuit inspection
Carefully inspect the integrity of the copper foil circuit for any open or short circuits. Check whether the width of the circuit meets the design rules, especially on some circuits with impedance control requirements. It is also necessary to check whether the spacing between copper foils and between copper foils and solder pads is sufficient to prevent electrical interference or short circuits.
5. Screen printing inspection
Confirm that the text and symbols on the silk screen layer are clear and legible, and their positions are accurate. The silk screen content should match the actual component packaging and circuit board layout, facilitating subsequent assembly and debugging. Check for any omissions, errors, or overlaps in the silk screen printing.
6. Inspection of solder mask layer
Check whether the opening of the solder mask layer is accurately aligned with the solder pads, vias, etc., and whether the opening size is appropriate. The function of the solder mask is to prevent the solder from flowing to areas that do not require welding during the welding process, so opening the window too large or too small may lead to poor welding. At the same time, check if there are any damages, omissions, or other issues with the solder mask layer.
7. Design rule check
Some advanced Gerber viewing software or PCB design software come with Gerber checking function, which can perform design rule checks. For example, checking whether the line width violates the minimum line width requirement, whether the spacing meets the safety spacing standard, and whether there are sharp angles, right angles, and other graphics that are not conducive to production.
8. Comparison with the original design
Compare the Gerber file with the original PCB design file to ensure that there is no information loss or incorrect conversion during the generation of the Gerber file. You can use some specialized comparison tools or carefully compare through features such as layered display and zooming in and out in Gerber viewing software.
9. Manufacturing process inspection
According to the manufacturing process requirements of PCB, check whether the Gerber files comply with relevant standards. For example, if it is a multi-layer board, check whether the laminated structure, interlayer alignment accuracy, etc. meet the requirements; If it is a surface mount process, check whether the size and shape of the solder pads meet the packaging requirements of SMD components.
10. Layout check
If the Gerber file contains imposition information, check whether the layout of the imposition is reasonable, whether the spacing between each sub board, the setting of stamp holes or V-CUT slots meet production requirements. At the same time, check whether the size of the assembled circuit board meets the limitations of the processing equipment.
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