Precision PCB Fabrication, PCB Assembly, Components sourcing,  No MOQ...
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PCB manufacturer in China 

PCB fabrication
PCB assembly

Components Sourcing
SysPCB is able to guarantee a complete service with comprehensive technical backup, offering a cost advantage and scheduled delivery. Products are applied to a wide range of High-tech industries. Our main services include bare PCB fabrication, PCB assembly, components sourcing, SMT stencil etc.. All products are compliant with IPC and UL standard. We are certificated with ISO-9001 2015.

About Company

SYS Technology Co., Ltd is a professional PCB manufacturer in China. We started PCB manufacturing in Shenzhen China since 2008. We have 2 manufacturing factories, PCB factory with 160 employees, and SMT factory with 30 employees.

SysPCB has abundant experiences of fabricating PCB and related products like components assembly and stencil. We are PCB specialist and has been supporting customers world widely for more than 10 years.

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Foreign Trade (Years)

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Product Center

Our Advantage
our advantage
  • Competitive Price
  • On Time Delivery​​​​​​​
  • Quality Guarantee​​​​​​​
  • International Standard
  • Professional Assembly

Hot Products

With the rapid expansion of the intelligent medical machinery market, the demand for medical machinery products in every country in the world continues to grow. 
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SYS Technology is a highly regarded communication PCB assembly, communication PCBA manufacturer, specializing in prototyping and low-volume construction in highly complex fields, or communication and industrial computing printed circuit board assembly (PCBA), PCB assembly, for Leading OEM's PCB Assembly Services.
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Heavy copper PCBs are mainly used in high-power distributors, heat sinks, planar transformers, and power ACs. We can produce Heavy copper PCBs up to 20oz. In general, if your circuit is going to pass a large current, it is recommended to choose a heavy copper circuit board. So what exactly is a heavy copper circuit board? Why choose heavy copper PCB for high current?
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High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006inch or less in diameter.
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Electronic devices with high frequency are the developing tendency nowadays, especially in the wireless networks. Satellite communication growing rapidly, information products move towards high speed and high frequency. Thus developing new products always need to use high frequency substrate, satellite system, mobile telephone receiving base station and so on, these communication products must use high frequency PCB.
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For each new electronic product, after the designer comes up with a design concept, the electronic engineer will start the circuit design and circuit layout, and then first make a prototype PCB to verify whether the design concept is feasible, and then conduct a small batch trial production, and finally can be mass-produced and marketed. Prototype PCB fabrication is an essential step in these steps.
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Multilayer board is a PCB with more than three conductive pattern layers and insulating material laminated between them. Multilayer PCB have multiple circuit layers, two of which are on the outer surface, and between each of the two layers is a dielectric layer. The dielectric layer can be made very thin, so the thickness of the multilayer PCB can be made just as thin as that of the double sided PCB. The electrical connections between them are usually made through plated through holes in the cross section of the board. Currently, SYS Technology is able to produce up to 64 layers.
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As a consumer, everyone relies on electronics these days. While cooking or listening to music, we can find electronics in our smartphones, laptops and TVs. Many cyclists rely on it, mobility has developed again with e-bikes, e-scooters, e-scooters and more. To ensure a positive response from the "end" consumer, many of SysPCB's customers rely on the quality and reliability we provide.
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Teflon PCB board, also known as polytetrafluoroethylene (PTFE) PCB board, is a special type of printed circuit board widely used in the field of high-performance electronics. It is made of polytetrafluoroethylene (PTFE) material, which has excellent electrical and physical properties, making it an ideal choice for high-performance electronic applications.
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MCPCB refers to Metal Core PCB (MCPCB), which is a printed circuit board that is attached to another metal with better thermal conductivity, which can improve the heat dissipation at the circuit board level. Aluminum based PCB is one of the most common types, which can provide efficient heat dissipation and cooling of electronic components, thereby improving the overall performance of the product.
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Rigid PCB is a type of rigid printed circuit board that has higher mechanical strength and stability compared to flexible printed circuit boards. Rigid circuit boards are typically made of fiber glass reinforced materials to support electrical connections through electronic components.
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Ceramic PCB refers to a special process board in which copper foil is directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single-sided or double-sided) at high temperature. The ultra-thin composite substrate produced has excellent electrical insulation performance, high thermal conductivity, excellent brazing performance, and high adhesion strength. It can also etch various patterns like other FR4 PCB boards, and has great current carrying capacity. Therefore, ceramic substrates have become the fundamental material for high-power power electronic circuit structure technology and interconnection technology.
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Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
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Flexible circuit board is a highly reliable and excellent flexible printed circuit board based on polyimide or polyester film. It has the characteristics of high density, light weight, thin thickness and good bending. By embedding circuit design on flexible thin plastic sheet, a large number of precision components are stacked in narrow and limited space to form a flexible circuit. This kind of circuit can bend at will, fold the weight light, the volume is small, the heat dissipation is good, the installation is convenient, broke through the traditional interconnection technology.
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Among all Metal core PCBs, Aluminum PCB is the most common type. The base material consists of an aluminum core and Prepreg. It features a thermal clad layer that dissipates heat in a highly efficient manner while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCB is regarded as the solution to high power and tight tolerance applications.
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Double-Sided PCB is the mostly used PCB board in electronics products, its circuits, paths and traces are contained on two sides and can connect various electronic components with electricity.
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News Center


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Benefits of using precious metals such as gold and silver on PCBs?

The primary goal of these processes is to prevent oxidation and enhance product yield during soldering. Additionally, to maintain the integrity of PCBs, manufacturers utilize vacuum plastic packaging and perform oxidation tests before delivery. Even if some oxidation occurs during prolonged use, it typically affects only the connection points and not the pads or soldered components. The article also addresses a common misconception regarding the use of gold and silver: while these metals have lower resistance, their minimal thickness on pads (less than 0.01 mm) does not significantly impact the overall resistance or heat generated in the PCB. Thus, the choice of plating materials primarily serves to protect against oxidation rather than to reduce heat generation.

2024-11-01
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PCB Board Design: How to Reduce Errors and Improve Efficiency?

Schematic simulation involves creating a schematic, setting up a test bench, and conducting simulations to verify connections and outputs at various nodes. By connecting probes to specific nodes, designers can monitor voltages and waveforms, automatically checking for errors. This approach not only enhances design efficiency and quality but also allows for easier adjustments and validation of design changes. Overall, schematic simulation significantly reduces design time and improves the likelihood of achieving accurate circuit board schematics.

2024-11-01
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The meaning of the characters on the PCB

This article explains the meanings of common characters printed on circuit boards. Each character typically represents a specific electronic component: Rx: Resistor (e.g., R1, R2 for multiple resistors) Cx: Non-polarized capacitor, often used for power input CEx: Electrolytic capacitor CY: Y capacitor (high voltage ceramic capacitor for safety) IC: Integrated circuit module Ux: Integrated circuit element Tx: Test point for factory testing Spk: Speaker (includes buzzers and horns) CONx: Connector Dx: Diode Lx: Inductor or bead LEDx: Light Emitting Diode Xx: Crystal oscillator RTH: Thermistor SW: Switch The article provides a quick reference for understanding these symbols in circuit diagrams, essential for designing and troubleshooting electronic circuits.

2024-11-01
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IC Substrate PCB: Advanced Technology in Modern Electronics

IC Substrate PCB​ represents a crucial advancement in electronic manufacturing, serving as an intermediary layer between integrated circuits and traditional printed circuit boards. This technology bridges the gap between microscopic IC components and larger PCB structures, enabling more sophisticated electronic devices. The substrate acts as a critical interface that manages complex signal routing, power distribution, and thermal dissipation while maintaining the integrity of electrical connections.

2024-10-31
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