Precision PCB Fabrication, PCB Assembly, Components sourcing,  No MOQ...
649_PCB-Manufacturer
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PCB manufacturer in China 

PCB fabrication
PCB assembly

Components Sourcing
SysPCB is able to guarantee a complete service with comprehensive technical backup, offering a cost advantage and scheduled delivery. Products are applied to a wide range of High-tech industries. Our main services include bare PCB fabrication, PCB assembly, components sourcing, SMT stencil etc.. All products are compliant with IPC and UL standard. We are certificated with ISO-9001 2015.

About Company

SYS Technology Co., Ltd is a professional PCB manufacturer in China. We started PCB manufacturing in Shenzhen China since 2008. We have 2 manufacturing factories, PCB factory with 160 employees, and SMT factory with 30 employees.

SysPCB has abundant experiences of fabricating PCB and related products like components assembly and stencil. We are PCB specialist and has been supporting customers world widely for more than 10 years.

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Product Center

Our Advantage
our advantage
  • Competitive Price
  • On Time Delivery​​​​​​​
  • Quality Guarantee​​​​​​​
  • International Standard
  • Professional Assembly

Hot Products

With the rapid expansion of the intelligent medical machinery market, the demand for medical machinery products in every country in the world continues to grow. 
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SYS Technology is a highly regarded communication PCB assembly, communication PCBA manufacturer, specializing in prototyping and low-volume construction in highly complex fields, or communication and industrial computing printed circuit board assembly (PCBA), PCB assembly, for Leading OEM's PCB Assembly Services.
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Thick copper PCBs are widely used in power systems and power electronics. The extra copper weight in PCBA production allows higher current to be conducted from the board and helps with heat dissipation. The most common thick copper PCBs are double-sided or multilayer.
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High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006inch or less in diameter.
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Electronic devices with high frequency are the developing tendency nowadays, especially in the wireless networks. Satellite communication growing rapidly, information products move towards high speed and high frequency. Thus developing new products always need to use high frequency substrate, satellite system, mobile telephone receiving base station and so on, these communication products must use high frequency PCB.
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For each new electronic product, after the designer comes up with a design concept, the electronic engineer will start the circuit design and circuit layout, and then first make a prototype PCB to verify whether the design concept is feasible, and then conduct a small batch trial production, and finally can be mass-produced and marketed. Prototype PCB fabrication is an essential step in these steps.
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Multilayer PCB refers to a circuit board with a multi-layer structure used in electronic devices, consisting of multiple conductive layers, insulation layers, and through holes connecting these layers, which can achieve complex circuit designs and functions.Currently, SYS Technology is able to produce up to 64 layers.
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As a consumer, everyone relies on electronics these days. While cooking or listening to music, we can find electronics in our smartphones, laptops and TVs. Many cyclists rely on it, mobility has developed again with e-bikes, e-scooters, e-scooters and more. To ensure a positive response from the "end" consumer, many of SysPCB's customers rely on the quality and reliability we provide.
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Teflon PCB (PTFE PCB board) is a circuit board made of polytetrafluoroethylene (PTFE) material as the substrate, which has excellent electrical insulation performance, thermal stability, and chemical stability.
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MCPCB refers to Metal Core PCB (MCPCB), which is a printed circuit board that is attached to another metal with better thermal conductivity, which can improve the heat dissipation at the circuit board level. Aluminum based PCB is one of the most common types, which can provide efficient heat dissipation and cooling of electronic components, thereby improving the overall performance of the product.
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Rigid PCB is a type of rigid printed circuit board that has higher mechanical strength and stability compared to flexible printed circuit boards. Rigid circuit boards are typically made of fiber glass reinforced materials to support electrical connections through electronic components.
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Ceramic PCB refers to a special process board in which copper foil is directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single-sided or double-sided) at high temperature. The ultra-thin composite substrate produced has excellent electrical insulation performance, high thermal conductivity, excellent brazing performance, and high adhesion strength. It can also etch various patterns like other FR4 PCB boards, and has great current carrying capacity. Therefore, ceramic substrates have become the fundamental material for high-power power electronic circuit structure technology and interconnection technology.
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Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
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Flexible circuit board is a highly reliable and excellent flexible printed circuit board based on polyimide or polyester film. It has the characteristics of high density, light weight, thin thickness and good bending. By embedding circuit design on flexible thin plastic sheet, a large number of precision components are stacked in narrow and limited space to form a flexible circuit. This kind of circuit can bend at will, fold the weight light, the volume is small, the heat dissipation is good, the installation is convenient, broke through the traditional interconnection technology.
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Among all Metal core PCBs, Aluminum PCB is the most common type. The base material consists of an aluminum core and Prepreg. It features a thermal clad layer that dissipates heat in a highly efficient manner while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCB is regarded as the solution to high power and tight tolerance applications.
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Double-Sided PCB is the mostly used PCB board in electronics products, its circuits, paths and traces are contained on two sides and can connect various electronic components with electricity.
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News Center


SMT Processing 拷贝.jpg
Requirements for layout of components during SMT assembly

Key layout principles include ensuring an even distribution of components, maintaining consistent arrangement angles, and providing adequate spacing around large components like BGAs and QFPs. Heat-radiating components should be placed in ventilated positions away from sensitive parts, while frequently adjusted components must be easily accessible. Proper spacing must account for thermal expansion, stress sensitivity, and large component tolerances. Additionally, PCB designs exceeding 500cm² should incorporate support structures to prevent bending during reflow soldering. Component placement should align with the reflow oven's conveyor belt angle to ensure thermal symmetry and optimal heat capacity. Adhering to spacing requirements ensures manufacturability, testability, and maintainability in SMT assembly.

2024-12-18
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KB6160 Datasheet

The KB6160 is a high-performance integrated circuit designed for applications in consumer electronics, industrial automation, automotive systems, and IoT devices. This blog explores its key specifications, including a 3.0V to 5.5V operating voltage range, -40°C to +85°C temperature range, and up to 50 MHz clock speed. The IC features low power consumption, high-precision ADC/DAC capabilities, multiple GPIO ports, and embedded protection. Typical applications include smartphones, industrial sensors, automotive ECUs, and IoT solutions. Design considerations such as thermal management and signal integrity are discussed. For complete technical details, the official KB6160 datasheet provides comprehensive guidance.

2025-01-17
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KB6165 Datasheet

The KB6165 is a high-performance integrated circuit designed for diverse applications in consumer electronics, industrial automation, automotive systems, and IoT devices. This blog highlights its key specifications, including an operating voltage range of 3.0V to 5.5V, operating temperature range of -40°C to +85°C, and clock speeds up to 50 MHz. The IC features low power consumption, high precision ADC/DAC capabilities, multiple GPIO ports, and embedded protection. Typical use cases range from smartphones to industrial sensors and automotive ECUs. Guidance on design considerations, such as thermal management and signal integrity, is provided to ensure optimal performance. For detailed implementation, refer to the official KB6165 datasheet.

2025-01-17
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LDO Output Voltage

Linear regulators are available in fixed, adjustable, and programmable output versions. Fixed output regulators provide a specified voltage range rather than an absolute voltage, influenced by factors like load current, temperature drift, and reference voltage stability. The deviation from the rated voltage is due to the non-ideal characteristics of components such as Zener diodes and internal resistance.

2024-01-22
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Phone: +86-0769-82201689
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