PCB Products

Environmental Classification: Solder paste is classified as leaded or lead-free (environmentally friendly). Lead-free solder paste is widely used in compliance with strict environmental regulations, especially for exported products. Lead-free soldering, particularly for components like BGA and QFN, often requires high-silver content pastes, which are more expensive.

Surface Mount Technology (SMT) inspections encompass various methods, including manual visual inspection, automatic optical inspection (AOI), X-ray inspection, and specialized tests such as ICT and flying probe tests. The choice of method depends on the specific stage and requirements of the process. Manual Visual Inspection is cost-effective and requires no programming but lacks reliability and scalability for modern high-density PCB assemblies, especially for components like 0201 and 01005. Enhanced visual tools such as microscopes and specialized instruments partially address these limitations.

Boundary Scan Testing, introduced in the 1990s by the Joint Test Action Group (JTAG), was developed to address testing challenges arising from the miniaturization and high-density designs of modern PCBs. Traditional in-circuit testing (ICT) methods struggled with the increased complexity, making boundary scan testing a vital alternative.

These PCB types cater to a range of electronic applications, from simple to highly complex, supporting advancements in electronic information technology.

PCBA board cleaning is essential for removing solder residues produced during SMT and THT processes, including wave soldering, reflow soldering, and manual soldering. The purpose of cleaning is to enhance the product’s lifespan by maintaining surface resistance and preventing leakage. Residues, such as organic acids and decomposable ions, can corrode PCBs and lead to short circuits, making thorough cleaning inevitable to meet cleanliness standards and customer expectations.

PTH and Stiffener Requirements: FPCs are typically thin and do not include plated through holes (PTH) unless specified by customers. When stiffeners are used, precise groove depths are needed to ensure flatness, especially under components. Groove Depth Accuracy: For stiffeners beneath components, grooves must match the stiffener thickness (e.g., 0.15-0.2 mm for a 0.2 mm stiffener). For non-direct placements, grooves can exceed the stiffener thickness. Milling and Silicone Paper: To improve production efficiency, milling sunk areas should exceed FPC size by 0.02-0.04 mm. Adding silicone paper can improve flatness, requiring adjustments to sunk area depth to account for paper thickness.