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In low-pass RC circuits, grounding the striped side enhances EMI shielding. For high-pass RC circuits and operational amplifier integration circuits, connecting the striped side to the low-impedance or less-sensitive node minimises noise interference. Proper orientation of the striped side in circuit layouts improves stability by reducing parasitic capacitance and ensuring optimal signal return paths. Understanding these design principles and leveraging manufacturer-provided guidelines can significantly enhance PCB and circuit design performance. Read More

With universal input ranges (85VAC–305VAC), seven voltage output options (3.3VDC to 48.0VDC), and compliance with international safety standards (IEC60950-1, IEC62368-1, IEC60335-1), the series ensures safe and versatile operation. Featuring 3kVAC insulation, Class II ratings, and low standby power (<300mW), these power supplies are optimized for energy-efficient and ground-free applications. Their integrated EMC filters and compact design eliminate the need for external components or heat sinks, reducing installation space and BOM costs. Ideal for smart home devices, heating and lighting controls, smart metering, set-top boxes, and industrial systems, the VCE20 and VCE40 offer a cost-effective, reliable solution for applications requiring space efficiency and low cost. Read More

The Bluetooth-based RF circuit design is crucial, with factors such as antenna layout and material selection affecting performance. ESD protection is essential to meet regional electronic testing standards. Additionally, reserving a system upgrade interface, whether through USB or wireless push, allows for convenient software updates, improving user experience and product lifecycle adaptability. Read More

A rectangular PCB shape with a 3:2 or 4:3 aspect ratio is generally ideal, with components positioned at least 2mm from the edges. Effective layout emphasizes parallel component arrangement for ease of soldering and mass production, compact placement around core circuit functions, and minimizing connection lengths. Engineers are advised to follow circuit flow for component placement to ensure efficient signal transmission and reduce radiated interference. Decoupling capacitors should be placed close to the VCC of devices, and layout adjustments should prioritize wiring rate and functional efficiency. While challenges remain, advancements in science and technology will enable LEDs to become increasingly efficient and reliable in the future. Read More

It also facilitates easy wiring by replacing large loops and serves as a placeholder for resistance values that are undecided during the design phase. During circuit testing, a zero-ohm resistor helps measure current without requiring permanent modifications. In high-frequency circuits, it can suppress noise, act as a small capacitor or inductor, and provide ground isolation between analog and digital circuits. Additionally, zero-ohm resistors are used for security protection by replacing pinheads and DIP switches, preventing signal interference and reducing the risk of misconfiguration. Through these applications, zero-ohm resistors improve the flexibility, reliability, and efficiency of circuit design and testing. Read More

The software supports three methods for coordinate acquisition: CAD files, PCB scanning, and GERBER file reading. It offers robust functionality, including BOM management, customizable component databases, and automatic production line balancing for improved efficiency. Additionally, the software supports program optimization for turret high-speed machines, program conversion between different machine formats, and station table output for efficient material handling. It supports a wide range of SMT machine models from manufacturers like PANASONIC, FUJI, and YAMAHA, making it versatile for various production environments. Read More

The development of Surface Mount Technology (SMT) is driven by advancements in assembly materials, adaptation to new surface components, and emerging assembly techniques like high-density and three-dimensional assembly. Key trends include strict installation orientations, fine pitch assembly processes with 0.3mm pin pitch, and improvements in assembly quality and yield. Future SMT development emphasizes three foundations: reducing costs, enhancing efficiency through automation and optimized management, and ensuring high product quality. Additionally, the industry focuses on achieving "Four Lows and Four Highs": low costs, negotiation complexity, order thresholds, and unit prices, alongside high automation, software efficiency, data analysis capability, and product yield. These factors are shaping SMT to meet the demands of modern, fast-evolving electronic product manufacturing. Read More

As consumer electronic devices integrate into everyday life, they must endure harsh environments while maintaining performance. Waterproof USB Type-C connectors address these demands, offering superior data transfer rates, fast charging capabilities, and environmental protection. Compared to traditional Micro USB connectors, USB Type-C supports up to 100W power delivery, 10Gb/s data transfer rates, and robust waterproofing with IPX8 ratings. These features meet the needs of modern devices such as smartphones, wearable electronics, and medical and automotive systems. USB Type-C connectors have become the preferred standard due to their reliability, enhanced signal integrity, and compatibility with various protocols, paving the way for the future of connectivity in consumer and industrial applications. Read More

This article explores the principles and functional characteristics of commonly used integrated circuit (IC) packaging methods, emphasizing their importance in electronic circuit design. It covers various IC packages, including DIP (Dual In-Line Package), QFP (Quad Flat Package), BGA (Ball Grid Array Package), SO (Small Outline Package), QFN (Quad Flat No-lead Package), and PLCC (Plastic Leaded Chip Carrier). Each packaging type's structural features, applications, and advantages are discussed. By understanding these packaging methods, electronic engineers can make more informed decisions when selecting ICs for specific circuit designs, optimizing for factors such as reliability, thermal performance, and high-frequency suitability. Read More

Environmental Classification: Solder paste is classified as leaded or lead-free (environmentally friendly). Lead-free solder paste is widely used in compliance with strict environmental regulations, especially for exported products. Lead-free soldering, particularly for components like BGA and QFN, often requires high-silver content pastes, which are more expensive. Read More

Surface Mount Technology (SMT) inspections encompass various methods, including manual visual inspection, automatic optical inspection (AOI), X-ray inspection, and specialized tests such as ICT and flying probe tests. The choice of method depends on the specific stage and requirements of the process. Manual Visual Inspection is cost-effective and requires no programming but lacks reliability and scalability for modern high-density PCB assemblies, especially for components like 0201 and 01005. Enhanced visual tools such as microscopes and specialized instruments partially address these limitations. Read More

Boundary Scan Testing, introduced in the 1990s by the Joint Test Action Group (JTAG), was developed to address testing challenges arising from the miniaturization and high-density designs of modern PCBs. Traditional in-circuit testing (ICT) methods struggled with the increased complexity, making boundary scan testing a vital alternative. Read More

These PCB types cater to a range of electronic applications, from simple to highly complex, supporting advancements in electronic information technology. Read More

PTH and Stiffener Requirements: FPCs are typically thin and do not include plated through holes (PTH) unless specified by customers. When stiffeners are used, precise groove depths are needed to ensure flatness, especially under components. Groove Depth Accuracy: For stiffeners beneath components, grooves must match the stiffener thickness (e.g., 0.15-0.2 mm for a 0.2 mm stiffener). For non-direct placements, grooves can exceed the stiffener thickness. Milling and Silicone Paper: To improve production efficiency, milling sunk areas should exceed FPC size by 0.02-0.04 mm. Adding silicone paper can improve flatness, requiring adjustments to sunk area depth to account for paper thickness. Read More

PCBA board cleaning is essential for removing solder residues produced during SMT and THT processes, including wave soldering, reflow soldering, and manual soldering. The purpose of cleaning is to enhance the product’s lifespan by maintaining surface resistance and preventing leakage. Residues, such as organic acids and decomposable ions, can corrode PCBs and lead to short circuits, making thorough cleaning inevitable to meet cleanliness standards and customer expectations. Read More

With increased EMI/EMC requirements and the use of RF shields, "AOI before reflow" has emerged as a preventive measure. It identifies defects like missing parts, alignment issues, and polarity errors prior to reflow, reducing post-soldering defects. It is particularly critical for designs involving shielding cases or large components that obstruct post-reflow inspection. By integrating "AOI before reflow," manufacturers can catch and correct defects early, improve production efficiency, and ensure comprehensive quality assurance in complex designs. Read More

The introduction of PCB-ECI aims to ease the adoption of smart manufacturing in Taiwan's PCB industry. While large PCB factories are increasingly automating their production materials, many small and medium-sized factories are unsure where to begin or face prohibitive costs. PCB-ECI facilitates easier entry into intelligent manufacturing by streamlining equipment communication and enabling the integration of production data. This real-time monitoring of production status, automatic line changes, and preemptive equipment diagnostics will improve efficiency and reduce production downtime. Read More

These checks include verifying the location of components according to the IPC-610-D standard, checking for missing components, impurities, scattered components, and damaged components. Any defects found must be corrected, and the cause of the defect must be identified. Components removed from the placement process cannot be reused. Quality control measures involve a detailed audit of each step in the placement process, including equipment maintenance, adherence to ESD guidelines, and a 100% visual inspection after line transformations. Additionally, the use of production raw materials such as cleaners, grease, and adhesives must comply with relevant regulations. Read More

SMT processing plays a crucial role in the electronic product manufacturing process, and the professional cooperation between the client and the SMT factory significantly impacts timely delivery and product quality. When evaluating an SMT processing factory, key factors include the attitude of cooperation, quality control, and employee and management appearance. Read More

Chip capacitors are among the most widely used components in SMT processing, playing a crucial role in ensuring the reliable performance of circuit boards. With the ongoing demand for miniaturization, high-speed performance, and low-cost solutions in electronic products, chip capacitors are evolving rapidly. To ensure their proper function, several technical indicators are important for selecting the right chip capacitors. Read More

Key to the success of SMT placement are precise control over the placement process, machine parameters, and quality monitoring. Regular maintenance of the placement machine and careful monitoring of placement quality are essential to avoid errors such as incorrect components, misplaced parts, or damaged components. Additionally, the machine's suction nozzles should be kept clean to prevent image processing errors caused by dust or foreign objects on the nozzle’s reflective surface. The rejected chip box is used to collect defective components identified by the image processing system, while the scrapped belts box accumulates waste materials. Both need regular maintenance to ensure efficient operation and prevent problems such as poor suction or insufficient vacuum, which could negatively impact the placement quality. Regular cleaning of these boxes is vital for maintaining the machine's performance and ensuring consistent production quality. Read More

Online burning offers significant advantages over offline methods, including reduced production costs, higher efficiency, and better compatibility with automated production lines. It eliminates the need to disassemble chips for reprogramming, simplifies fault rectification, and integrates seamlessly with functional test machines (ICT and FCT) for full automation. As automation advances, online burning has become a critical indicator of a PCBA manufacturer’s process precision, production efficiency, cost-effectiveness, and quality control capabilities. This trend highlights the growing importance of online burning in modern PCBA manufacturing processes. Read More

Tooling holes are essential for PCB testing, requiring at least two uncoated holes positioned diagonally with precise tolerances. Double-sided PCBs should aim for single-sided testability by ensuring through-holes on the SMD side can serve as test points on the DIP side. Special considerations include avoiding fragile SMT components as test points and ensuring proper test pad placement near vias. The guidelines aim to enhance test efficiency, minimize fixture costs, and improve test accuracy in ICT processes. Read More

ICT fixtures can test a range of components, including resistors, capacitors, inductors, crystal oscillators, and integrated circuits, while diagnosing process issues such as solder shorts, incorrect insertions, or missing components. Automated testing allows quick fault detection and accurate fault localization, reducing maintenance complexity and enhancing production efficiency. As the first test procedure in production lines, ICT testing plays a critical role in ensuring manufacturing quality and enabling timely process improvements in large-scale production environments. Read More

This text explains two common soldering methods in PCBA processing: reflow soldering and wave soldering. Reflow soldering involves using solder paste to connect tiny electrical components to contact pads, which are then heated in a controlled environment to form permanent solder joints. This method is primarily used for SMD (surface-mount device) components. In contrast, wave soldering is a batch process where PCBs pass through a molten solder wave to solder components, commonly used for through-hole components. Key differences include the presence of solder on the PCB before heating in reflow soldering versus its application during the process in wave soldering, as well as their suitability for different component types. Both methods are integral to modern PCB assembly. Read More

This text outlines the fundamental principles of PCB design, focusing on component layout and wiring guidelines. It emphasizes the balanced, dense, and orderly placement of components, prioritizing key components like microprocessors and memory based on data flow and proximity. Memory modules are recommended to be placed side by side to minimize trace lengths. The layout should align with the signal flow while considering mechanical structure, heat dissipation, and EMI factors. Wiring principles highlight the importance of meeting current-carrying requirements, maintaining appropriate spacing to prevent insulation breakdown, and ensuring clear and simple traces. Special attention is given to parallelism in signal lines to reduce interference and improve PCB stability through techniques like copper pouring. Read More

In recent years, the electronics industry has seen a significant shift towards sustainability and environmental responsibility. One of the key developments in this area is the rise of halogen-free printed circuit boards (PCBs). This article explores what halogen-free PCBs are, their benefits, applications, and why they are becoming increasingly important in modern electronics manufacturing. Read More

Integrated Circuit (IC) substrates and Printed Circuit Boards (PCBs) are fundamental components in the realm of electronics. They serve as the backbone for electronic devices, enabling the functionality and performance of various applications. Understanding their roles, manufacturing processes, materials, and current trends is crucial for anyone involved in electronics design and production. Read More

Flexible printed circuits (FPCs) are increasingly used in smartphones for connecting various modules such as display, fingerprint sensors, cameras, antennas, and vibrators. The adoption of dual- and triple-camera systems, as well as OLED and AMOLED displays, is driving the demand for FPCs. The camera module market is growing rapidly, with the introduction of dual-camera systems by companies like Huawei, Vivo, and Apple. Additionally, foldable smartphones are boosting the demand for flexible AMOLED displays. The shipment of flexible AMOLEDs has increased significantly, and it is expected to continue growing. FPC usage in smartphones is also increasing, with flagship models like the iPhone X using up to 20 pieces. While major smartphone brands like Apple and Samsung have historically sourced FPCs from suppliers in Japan, Taiwan, and South Korea, there is increasing potential for Chinese suppliers to enter the market and replace imports. Read More

In PCB design, electromagnetic interference (EMI) is radiated from the edges of the power and ground layers due to the electric field between them. To mitigate this, the power layer can be retracted to reduce EMI radiation. The 20H rule suggests that shrinking the power layer by 20 times the thickness of the medium (H) between the power and ground layers can contain 70% of the electric field within the ground layer, and by 100H, it can contain 98%. This rule is crucial for reducing edge radiation in power supply planes, especially for EMC compliance. The rule applies under specific conditions, including short rise/fall times of current fluctuations, internal power planes with adjacent 0V planes, non-resonating power bus structures, and multi-layer PCB designs (at least 8 layers). Read More