Table of Contents
Prepare Complete Inquiry Materials First
– Manufacturing files: Provide Gerber or ODB++, drill files, board outline, and version number; list any special instructions separately.
– Stack-up and materials: Confirm the number of layers, finished board thickness, copper thickness, dielectric materials, and the purpose of each layer; if there are impedance requirements, provide target impedance and tolerance.
– Process parameters: Specify surface treatment, solder mask and silkscreen colors, minimum trace width/spacing, hole sizes, and special processes such as blind/buried vias or HDI.
– Quantity and panelization: Clearly state the single-board dimensions, quantity, panelization requirements, delivery packaging, and whether depanelization is required.
– Testing requirements: Confirm whether electrical testing, impedance test coupons, cross-sections, or other inspection reports are required, and state the acceptance criteria.
– Timing and delivery: Specify the expected arrival date, delivery region, tax invoice requirements, and whether alternative processes are acceptable.
When requesting a quote, asked detailed costs
Multilayer board quotations are also affected by materials, copper thickness, hole structure, impedance control, special processes, quantity, and engineering handling. It is recommended that suppliers explain what the quotation includes: how engineering fees, panelization, testing, packaging, taxes, logistics, and expediting fees are calculated separately; at the same time, confirm whether the lead time starts from complete document submission, engineering review approval, or payment. If different manufacturers use different stack-ups or process, a quotation that looks cheaper may not be directly comparable.
How to Inspect Samples Upon Arrival?
– Check the board number, version, quantity, outline dimensions, and board thickness.
– Inspect whether the surface finish, solder mask, legend, pads, and hole positions meet requirements.
– For critical nets, impedance requirements, and special hole structures, verify according to the previously agreed testing/report requirements.
– Record physical issues, file versions, and the supplier’s handling conclusions to provide a basis for the next revision.
Practical Approaches When Communicating with PCB Manufacturers
First send an engineering data checklist with sensitive information removed to confirm whether the other party can evaluate according to requirements, and then provide formal production files. Further communication can be based on layer count, process, quantity, and delivery requirements. The actual feasible processes and lead time are subject to engineering review and formal confirmation results.
