Flex PCB Capability
| Serial | ltem | Technical Data |
| 1 | Layer | Flex board: 1-4Layers. |
| 2 | Material | PI, PET, PEN, FR-4 |
| 3 | Final Thickness | Flex board: 0.002″-0.1″(0.05-2.5mm) |
| 4 | Surface Treatment | Lead-free HAL,ENlG, OSP, Immersion silver, lmmersion Tin |
| 5 | Max./ Min. Board Size | Min:0.2″x0.3″ Max: 20.5″x13″ |
| 6 | Min. Trace | Inner:0.50z:4/4mil Outer: 1/30z-0.50z:4/4mil |
| 7 | Width / Min. Clearance | 10z:5/5mil 10z:5/5mil 20z:5/7mil 20z:5/7mil |
| 8 | Min. Hole Ring | Inner: 0.50z: 4mil 10z:5/5mil20z:5/7mil Outer: 1/30z-0.50z:4mi10z: 5mil20z: 7mil |
| 9 | Copper Thickness | 1130z-20z |
| 10 | Max./Min.insulation Thickness | 2mil/0.5mil (50um/12.7um) |
| 11 | Min. Hole Size and Tolerance | Min hole: 8mil Tolerance: PTH+3mil, NPTH+2mil |
| 12 | Min. Slot | 24mil x 35mil (0.6×0.9mm) |
| 13 | Solder Mask Alignment Tolerance | ±3mil |
| 14 | Silkscreen Alignment Tolerance | ±6mil |
| 15 | Silkscreen Line Width | 5mil |
| 16 | Gold Plating | Nickel: 100u”-200u”, Gold: 1u”-4u” |
| 17 | lmmersion Nickel / Gold | Nickel: 100u” -200u”,Gold: 1u”-5u” |
| 18 | lmmersion Silver | Silver: 6u”-12u” |
| 19 | OSP | Film: 8u”-20u” |
| 20 | Test Voltage | Testing Fixture:50-300V |
| 21 | Profile Tolerance of Punch | Accurate mould: +2milOrdinary mould: ±4milKnife mould: ±8milHand-Cut: +15mil |
The concept and core characteristics of Flex PCB
FPC (Flexible PCB) is a flexible electronic component based on polyimide or polyester film, which forms conductive lines through etching process and has the characteristics of bendability, lightweight, and folding resistance. Its structure usually includes a flexible substrate layer, a conductive copper foil layer, and an insulating protective layer, which can adapt to complex three-dimensional spatial layouts and meet the needs of modern electronic devices for miniaturization and lightweighting. Compared to traditional rigid PCB (Printed Circuit Board), FPC breaks through the bottleneck of rigid circuit board in terms of space limitation and dynamic environmental adaptability through the physical properties of flexible substrate, becoming an ideal choice for high-density and high reliability electronic design.
Wide application areas of FPC
FPC, with its unique performance, has penetrated into multiple high-tech fields:
Consumer electronics
Smartphones, wearable devices (such as smartwatches), tablets, etc. rely on FPC to achieve flexible connections between screens, camera modules, and motherboards, improving device compactness and durability.
Automotive Electronics
In car displays, battery management systems (BMS), sensors, and advanced driver assistance systems (ADAS), FPC’s temperature resistance and vibration resistance ensure the stability of signal transmission, helping to promote the intelligent development of electric vehicles.
Medical equipment
Precision medical equipment such as endoscopes and life monitoring devices are designed to be miniaturized through FPC, while ensuring high reliability signal transmission to meet the stringent requirements of medical scenarios.
The significant advantages of FPC compared to rigid PCB
1. Flexibility and Space Utilization
FPC can be freely bent and folded to adapt to narrow or non planar space layouts, reducing equipment volume and weight. For example, foldable phones use FPC to achieve dynamic circuit connections in the hinge part, while rigid PCBs cannot meet such design requirements.
2. High reliability and durability
The bending resistance (such as supporting thousands of bends) and impact resistance of FPC make it perform excellently in dynamic scenarios such as automotive vibration and industrial machinery movement, with a significantly lower failure rate than traditional wire harnesses or rigid PCBs.
3. Production efficiency and cost-effectiveness
Although the initial manufacturing cost of FPC is relatively high, its lightweight design can reduce the overall equipment cost, and automated production processes (such as laser splitting technology) greatly improve processing efficiency and accuracy, resulting in significant long-term economic benefits.
Five reasons to choose us as an Flex PCB supplier
1. Flex PCB Capability
We have multiple FPC patented technologies, covering high-density interconnect (HDI), multi-layer flexible board design, and electromagnetic compatibility optimization, which can meet performance requirements in extreme environments such as high frequency and high temperature. For example, through laser direct imaging (LDI) technology, ultra-high precision machining can be achieved, which is compatible with miniaturized equipment design.
2. Full process quality assurance
From raw material procurement to production and manufacturing, we strictly follow international automotive grade certification and UL safety standards, equipped with AOI (Automatic Optical Inspection) and X-Ray testing equipment to ensure product yield exceeds 99.8% and impedance deviation is controlled within ± 5%.
3. Quick response and customized services
We provide 24-hour sample making and 72 hour bulk delivery services to support customers in quickly iterating products. For special needs in the fields of new energy vehicles, medical equipment, etc., differentiated solutions such as high temperature resistance (-50 ℃~200 ℃) and corrosion resistance can be customized.
4. Green Manufacturing and Sustainable Development
Adopting environmentally friendly substrates (such as ROHS certified polyimide) and dust-free production processes to reduce carbon emissions and waste generation. At the same time, FPC’s recyclability helps customers cope with global environmental regulations and achieve green supply chain management.
5. Industry experience and customer trust
We have been deeply involved in the FPC field for over ten years, providing services to top global customers in consumer electronics, automotive, medical, and other industries. We have delivered over ten million high-end FPC products. We focus on efficient collaboration and technological innovation, continuously creating value for our customers.
About Flex PCB Capability
FPC, as a key component in the electronics industry, is driving the development of smart devices towards thinner and more reliable directions. Whether it is the revolution of foldable screen smartphones or the intelligent upgrade of new energy vehicles, the technological advantages of FPC are indispensable. By choosing us as your partner, you will receive comprehensive services from design support to mass production delivery, leading the future of flexible electronic technology together.