How to do heat resistance testing for PCB board?

In order to ensure the quality of the PCB circuit board, it is necessary to carry out a temperature resistance test. The purpose is to prevent the PCB from experiencing adverse reactions such as bursting, blistering, and delamination at excessively high temperatures, resulting in poor product quality or direct scrapping. The temperature problem of PCB is related to the bearing temperature of raw materials, solder paste and surface parts. Usually, the maximum temperature of PCB circuit boards can withstand 300 degrees, 5-10 seconds. The temperature is about 260 degrees for lead-free wave soldering, and about 240 degrees for lead-free soldering.

So how does the PCB do heat resistance testing?

1. Prepare PCB samples and tin furnaces;

Sampling 10*10cm substrate (or laminated board, finished board) 5pcs (without foaming and delamination)

Substrate: 10cycle or more

Laminate board: 10cycle or more

HTg material: 10cycle or more

Normal material: 5cycle or more

2. Set the temperature of the tin furnace to 288±5 degrees, and use the contact thermometer to measure and correct.

3. First dip the flux with a soft brush and apply it to the surface of the board; then use the crucible tongs to pick up the test board and immerse it in the tin furnace. After 10 seconds, take it out and cool it to room temperature. Visually check whether there is foaming and burst the board, this is 1 cycle.

4. If there is a problem of blistering and bursting the board visually, stop tin immersion and analyze the initiation point f/m immediately; if there is no problem, continue to cycle until the board bursts, with 20 times as the end point.

5. The blistering area needs to be section and analyzed to find the source of the detonation point.

The above is the content of the heat resistance test of the PCB circuit board. As for the temperature resistance of the PCB circuit board of different materials, it is necessary to understand in detail, and not exceed its maximum limit temperature, so as to avoid the scrapping of the PCB circuit board.