Challenge for heat radiating to PCB

1. Dimensional Stability

Compared to FR4 PCBs, metal core PCBs exhibit significantly greater dimensional stability. When subjected to temperature variations from 30°C to 140–150°C, aluminum PCBs experience only a minimal dimensional change of approximately 2.5–3%. This enhanced stability makes metal core PCBs particularly well-suited for high-temperature and high-humidity environments.

2. Thermal Conductivity

Effective heat dissipation remains a critical challenge for high-density, high-power double-sided and multilayer PCBs. Conventional PCB materials such as FR4 and CEM-3 have poor thermal conductivity and high interlayer insulation resistance, making it difficult to dissipate heat efficiently. This thermal buildup can lead to operational errors and reliability issues. In contrast, aluminum PCBs offer excellent thermal conductivity, making them an ideal cooling solution for heat-intensive applications.

3. Thermal Expansion

All materials expand with heat and contract with cooling, and different materials have varying coefficients of thermal expansion (CTE). In FR4 PCBs, the significant difference in Z-axis CTE between plated copper within via walls and the surrounding insulating material can lead to microcracks in metalized holes if heat is not dissipated efficiently. This compromises the PCB's reliability. Metal core PCBs (MCPCBs) effectively manage heat dissipation and mitigate the effects of thermal expansion and contraction, thereby enhancing the durability and long-term reliability of electronic devices.

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