The basic processes of PCBA manufacturing is SMT mounting of components, DIP plug-in and wave soldering of PCB boards. In this article, China PCBA manufacturer Technology will briefly describe the basic process of PCBA manufacturing.
The PCBA manufacturing process can be roughly divided into the following processes: SMD mounting → DIP plug-in processing → PCBA testing → finished product assembly.
After the solder paste is taken out from refrigerator and thawed, it needs to be mixed before it can be used.
Use a squeegee to print the solder paste on the stencil onto the PCB pads.
SPI is the solder paste thickness detector.
The SMD components are placed on the feeder, and the placement machine head accurately mounts the components from the feeder to the PCB pads through identification system.
The mounted PCB board undergoes reflow soldering to heat the solder paste into a liquid status, then cool and solidify to complete the soldering process.
AOI is automatic optical inspection, which detects the welding effect of PCB boards to eliminate bad PCB boards.
Rework the defective boards detected by AOI or manual inspection.
Insert the plug-in components onto the PCB board.
The inserted board is soldered by wave soldering.
The pins of the through hole components that have been soldered are generally too long and need to be cut.
Use an electric soldering iron to manually solder the components.
After wave soldering, the board will be dirty, so it needs to be cleaned with washing water and washing tank, or washing with a machine.
The PCB board is inspected, the unqualified products need to be repaired, and the qualified products can enter the next process.
According to different products and different customer requirements, different testing methods are used to detect whether PCBA products meet PCBA manufacturing requirements.
The qualified PCBA products are assembled in the shell, and then tested. After the test is passed, the shipment can be arranged.