pcb and assembly

Aging is a step in the PCBA processing that, while not the most critical, requires adherence to specific standards. SYS Technology, a professional PCBA manufacturer, follows strict aging specifications based on IPC standards such as IPC-TR-464 for solderability evaluation and the IPC-TR-465 series for steam engine temperature control and the effects of steam aging. The PCBA aging test process includes three main steps: (1) Low-temperature testing at -10±3℃ for 1 hour while running programs under rated load; (2) High-temperature testing at 80±3℃ for 1 hour with similar conditions; and (3) High-temperature and high-humidity testing at 65±3℃ and 90-95% humidity for 48 hours, all while ensuring the proper functioning of programs and procedures. Read More

According to JPCA statistics for July 2015, Japan's printed circuit board (PCB) production, including rigid, flexible, and IC substrate PCBs, increased by 16.8% year-over-year, reaching 1.368 million square meters. Sales volume grew by 12.2% to 47.028 billion yen. Flexible PCB production soared by 103.8%, marking the 11th consecutive month of growth, while IC substrate PCB production rose by 7.1%. Conventional FR4 PCB production remained steady, ending a six-month decline. For the first seven months of 2015, overall PCB production in Japan grew by 0.6%, with total sales increasing by 8.2%. Read More

Vias are crucial for signal routing in PCBs, connecting different layers to manage high-density interconnections. There are three types of vias: through vias, blind vias, and buried vias, with blind vias being laser drilled. Vias introduce parasitic capacitance, inductance, and impedance, impacting signal integrity, especially in high-speed circuit designs. To minimize issues, avoid unnecessary vias, remove unnecessary pads, and ensure balanced via usage in differential traces. Power vias, unlike signal vias, can be a bottleneck for current capacity. For thermal management, increasing via plating thickness, pad size, and using multiple small vias can improve thermal performance. However, buried or blind vias have higher thermal resistance compared to through vias. Read More

Many projects of hardware engineers are completed on pegboards, but there is a phenomenon of accidentally reversing the positive and negative poles of the power supply, and it can result in many electronic components being burned out, and even the entire board being scrapped, and at the same time, a Read More

Varactor diodes, also known as "variable reactance diodes", are made by using the characteristic that the junction capacitance changes with the applied voltage when the pN junction is reverse biased. When the reverse bias voltage increases, the junction capacitance decreases, and conversely, when th Read More

TVS is a high-efficiency protection device in the form of a diode. After the device is correctly selected, has the design been completed? How to make TVS use the best efficiency in the circuit? The layout and wiring of the printed circuit board is very important. Through the reasonable placement of Read More

An excellent hardware engineer, in addition to strong basic theoretical knowledge, proficient in hardware schematic design technology, hardware PCB diagram design, and hardware debugging, must also have the ability to learn quickly, understand communication protocols and standards, and have the abil Read More