What Should be Noted When Repairing PCBA Boards

As an important component of electronic equipment, the repair process of PCBA requires strict adherence to a series of technical specifications and operational requirements to ensure repair quality and equipment stability. This article will explore in detail the key points to pay attention to when repairing PCBA from multiple aspects, hoping to be helpful to you.

First of all, let’s talk about the baking requirements. 

Baking treatment is crucial during the repair process of PCBA boards. Firstly, for the new components to be installed, they must be baked and dehumidified according to their moisture sensitivity level and storage conditions, in accordance with the relevant requirements of the "Specification for the Use of Moisture Sensitive Components". This can effectively remove moisture from the components and avoid problems such as cracks and bubbles during the welding process; Secondly, if it is necessary to heat up to above 110 ℃ during the repair process, or if there are other moisture sensitive components around the repair area, baking and dehumidification treatment should also be carried out according to the specifications to prevent damage to the components caused by high temperatures and ensure the smooth progress of the repair process. Finally, for moisture sensitive components that need to be reused after repair, if repair techniques such as hot air reflux and infrared heating of solder joints are used, they also need to be baked and dehumidified; If the repair process of manually heating solder joints with a soldering iron is used, the pre baking treatment step can be omitted under the premise of controlling the heating process.

Second, the storage environment requirements is also important. 

After baking treatment, moisture sensitive components, PCBA and so on should also pay attention to the storage environment. If the storage conditions exceed the deadline, these components and PCBA boards must be re baked to ensure good performance and stability during use. Therefore, when repairing, it is necessary to closely monitor the temperature, humidity and other parameters of the storage environment to ensure compliance with regulatory requirements. At the same time, regular inspections and baking should also be carried out to prevent potential quality issues.

Last but not least, the requirement for repair heating frequency cannot be ignored. 

According to regulatory requirements, the cumulative number of repairs and heating for components shall not exceed 4 times, the allowable number of repairs and heating for new components shall not exceed 5 times, and the allowable number of repairs and heating for dismantled and reused components shall not exceed 3 times. These limitations are to ensure that components and PCBA are not excessively damaged during multiple heating cycles, affecting their performance and reliability. So during the repair process, it is necessary to strictly control the heating frequency. At the same time, for components and PCBA boards that have already approached or exceeded the heating limit, their quality status should be carefully evaluated to avoid using them in critical areas or high reliability equipment.