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In the printed circuit board (PCB) industry, rigid PCBs account for 70% of the market share, making them the largest segment. The manufacturing process of rigid PCBs primarily involves four main materials: CCL (copper-clad laminate), copper foil, film, and various chemicals. Among these, CCL constitutes the highest proportion of raw material costs, ranging from 50% to 70% depending on the number of layers. The main materials for the copper substrate are fiberglass cloth and electrolytic copper.
The key materials used in rigid PCBs include:
CCL accounts for the highest proportion of material costs in the manufacturing process.
Used to create electrical paths.
Provides insulation and protection between layers.
Used for etching, cleaning, and other processes.
Fiberglass cloth, electrolytic copper, and copper foil are the primary materials for printed circuit boards. Fiberglass cloth provides structural strength and insulation properties, while electrolytic copper and copper foil form the circuits.
High-Density Interconnect (HDI) PCBs offer several advantages, such as small size, high speed, and high frequency. They are essential components in personal computers, portable computers, mobile phones, and personal digital assistants (PDAs). Besides mobile phones, HDI PCBs are also widely used in various other consumer electronics, such as game consoles and MP3 players. Additionally, the use of HDI PCBs in notebook computers has been an industry trend since 2006.
HDI PCBs are widely used in:
In the PCB manufacturing industry, rigid PCBs and HDI PCBs play a crucial role due to their material properties and wide range of applications. As technology advances and application fields expand, these materials and technologies will play an even greater role in various industries.
