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Metal Core Aluminum PCB Material

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Metal Core Aluminum PCB (MCPCB) is a special type of PCB that includes a metal layer as its supporting part, typically aluminum, known for its high thermal conductivity. Copper can also be used as a base, providing better thermal conductivity. MCPCBs are suitable for drilling, punching, shearing, cutting, and other standard mechanical processes. Common surface treatments include gold plating, HASL (Hot Air Solder Leveling), OSP (Organic Solderability Preservatives), immersion gold, and lead-free ROHS process.


Structure of Metal Core LED Aluminum PCB


Structure of Metal Core LED Aluminum PCB


Metal Core LED Aluminum PCB consists of three layers: the circuit layer (copper foil layer), thermal insulation layer, and the metal core layer. The circuit layer requires a high current-carrying capacity, thus thicker copper foil is used, generally ranging from 35um to 280um. The thermal insulation layer is the core technology of aluminum PCBs, usually made of special ceramics and filled with unique polymers. This layer offers low thermal resistance, good viscoelasticity, and thermal aging ability, capable of withstanding mechanical and thermal stress. High-performance aluminum PCBs, such as IMS-H01, IMS-H02, and LED-0601, use this technology, providing excellent thermal conductivity and high-strength electrical insulation.


Application in LEDs and Components


Aluminum PCBs act as the heat conduction carrier for LEDs and components. Heat dissipation primarily relies on surface area, and materials with high thermal conductivity, such as those from Bergquist, are recommended.


Features of Metal Core PCBs


Key features of Metal Core PCBs, especially aluminum PCBs, include:


1. Thin insulation layer with low thermal resistance;


2. Non-magnetic properties;


3. Excellent heat dissipation;


4. High mechanical strength;


5. Standard thicknesses: 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm, and 3.0mm;


6. Copper foil thicknesses: 1.8um, 35um, 70um, 105um, 140um;


7. Applications: Dedicated for LEDs and power hybrid ICs (HIC).

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