The Basic Standards of FPC Testing And Methods To Improve The Efficiency of FPC Testing This article introduces the basic standards of FPC testing and methods to improve testing efficiency. With electronic products becoming thinner, the demand for FPC has increased. FPC, mainly used for circuit connection in electronic products, features ultra-thin, high density, high reliability, and bending resistance. Testing from aspects of appearance, process, and performance is crucial for enhancing FPC product yield and preventing defects from entering the market. Using spring micro-needle modules can enhance testing efficiency. Mastering the basic standards of FPC testing contributes to testing stability and maximizing the performance of FPC.
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