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PCB pad contamination inspection

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Cause And Improvement of Tombstone And Misalignment in SMT
The article discusses the causes and improvements of tombstone and misalignment issues in SMT. Key causes include asymmetrical PCB design, component placement shifts, component quality issues, PCB pad contamination, inconsistent solder paste printing, conveyor belt vibrations, and excessive hot air speed in the reflow oven. Suggested improvements involve better PCB design, precise component placement, enhanced inspection of components and PCBs, regular stencil cleaning, and adjusting conveyor belt and reflow oven settings. Read More

PCB pad contamination inspection

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PCB pad contamination inspection

PCB pad contamination inspection

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