Miniaturization

High-density interconnect (HDI) technology enables PCB designers to increase routing density, reduce layer count, and improve thermal and electrical performance. This is achieved by using advanced via configurations such as blind, buried, and microvias. Through-hole (TH) vias connect outer layers, blind vias connect outer and inner layers, and buried vias only connect inner layers. Microvias are a type of blind via with extremely small drill sizes. HDI technology also requires careful attention to electromagnetic interference (EMI), thermal management, layer stack-up, and component placement, particularly for ball-grid array (BGA) components. The miniaturization of electronics through HDI allows for lighter, smaller, and more functional products, positioning HDI as a key enabler of future technological advancements. Read More

The text highlights the challenges in adapting existing printed circuit board (PCB) standards for the growing wearable electronics market, focusing on three key areas: board surface materials, RF/microwave design, and RF transmission lines. It compares FR4, the most cost-effective PCB material, with advanced Rogers materials, noting that while FR4 has a higher dissipation factor (Df) and dielectric constant (Dk), Rogers materials offer lower values, which is critical for high-speed, high-frequency applications. The importance of solid ground and power planes in minimizing crosstalk and electromagnetic interference (EMI) during PCB layout is emphasized. As miniaturization drives the demand for more compact and densely packed boards, PCB designers and manufacturers are adopting new technologies to meet the unique challenges of wearable devices, ensuring that PCB manufacturing remains a dynamic field. Read More

Explore the latest trends in rigid PCB development, focusing on high-density, high-precision, miniaturization, high reliability, and environmental sustainability. Learn how advancements in PCB technology are shaping the future of electronic devices. Read More

This article discusses the failure analysis of Printed Circuit Boards (PCBs), emphasizing the significance of such analysis in identifying issues, resolving failures, and determining responsibilities. The article outlines the basic procedure of failure analysis, including determining the failure location and mode, analyzing the failure mechanism, and investigating the causes of failure. Read More