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The Basic Standards of FPC Testing And Methods To Improve The Efficiency of FPC Testing
This article introduces the basic standards of FPC testing and methods to improve testing efficiency. With electronic products becoming thinner, the demand for FPC has increased. FPC, mainly used for circuit connection in electronic products, features ultra-thin, high density, high reliability, and bending resistance. Testing from aspects of appearance, process, and performance is crucial for enhancing FPC product yield and preventing defects from entering the market. Using spring micro-needle modules can enhance testing efficiency. Mastering the basic standards of FPC testing contributes to testing stability and maximizing the performance of FPC. Read More
PCB Failure Analysis
This article discusses the failure analysis of Printed Circuit Boards (PCBs), emphasizing the significance of such analysis in identifying issues, resolving failures, and determining responsibilities. The article outlines the basic procedure of failure analysis, including determining the failure location and mode, analyzing the failure mechanism, and investigating the causes of failure. Read More

High density

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