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Moisture Sensitivity Levels (MSL) Classifications
Modern technology demands smaller electronic components, which have poorer moisture resistance and struggle with high-temperature reflow soldering. IPC/JEDEC defined Moisture Sensitivity Levels (MSL) to assess component moisture resistance. Higher MSL levels indicate greater moisture sensitivity. MSL testing involves soak requirements and electrical testing to ensure functionality under specified conditions. Standards include J-STD-020 for IC manufacturers and J-STD-033 for general EMS factories. Read More

Dual In-line Package (DIP)

SysPCB is a leading China Dual In-line Package (DIP) manufacturer, suppliers and factory. Adhering to the pursuit of perfect quality of products, so that our Dual In-line Package (DIP) have been satisfied by many customers. Extreme design, quality raw materials, high performance and competitive price are what every customer wants, and that's also what we can offer you. Of course, also essential is our perfect after-sales service. If you are interested in our Dual In-line Package (DIP) manufacturing services, you can consult us now, we will reply to you in time!

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Dual In-line Package (DIP)

Dual In-line Package (DIP)

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