IC Substrate PCB

IC substrate PCB board is a key substrate in integrated circuit packaging, also known as packaging substrate. It is a high-end product with high technical difficulty in the PCB industry, located between the chip and the PCB, realizing signal transmission connection, providing protection and support for the chip, and forming a heat dissipation channel to ensure that the packaged chip meets the required size.

IC Substrate PCB board plays a crucial role in advanced packaging technology and is widely used in mainstream packaging technologies such as BGA, CSP, MCM, and SIP for high-density IC packaging.

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Product Description

Compared to ordinary PCBs, IC Substrate PCBs have the advantages of thinner board body, finer line width and spacing, smaller aperture, etc., requiring more precise alignment technology, electroplating technology, etc. In addition, it also plays a role in protecting, supporting, dissipating heat, and forming standardized installation dimensions.

As a high-end PCB board, IC carrier board has the characteristics of high density, high precision, miniaturization, and lightweight, and is widely used in downstream application fields such as mobile terminals, communication devices, services/storage, etc.

IC Substrate PCB-1

It can be classified according to packaging methods, processing materials, and application fields:

(1) According to the packaging method, IC substrates are classified into BGA packaging substrates, CSP packaging substrates, FC packaging substrates, and MCM packaging substrates.

(2) IC carrier boards can be roughly divided into three categories based on their materials:

Hard substrate: The main materials are BT/ABF/MIS; Its main application areas include: communication and memory chips, LED chips/CPUs, GPUs and chipsets, and a large number of high-end chip/analog, power IC, and digital currency market fields.
Flexible substrate: The main materials are PI/PE; Its main application areas are automotive electronics, consumer electronics, and can also be applied to military applications such as launch vehicles, cruise missiles, and space satellites.
Ceramic substrate: The main materials are alumina/aluminum nitride/silicon carbide; And its application fields include semiconductor lighting, laser and optical communication, aerospace, automotive electronics, deep-sea drilling, etc.

(3) According to the classification of application fields, IC carrier boards are divided into storage chip packaging substrates, microelectromechanical system packaging substrates, RF module packaging substrates, processor chip packaging substrates, and high-speed communication packaging substrates.

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