PCB Manufacture Overview, PCB Manufacturer in China_

PCB Manufacture Overview

SysPCB was established in Shenzhen in 2006 and has a history of 17 years. SysPCB's core competencies of high mix, high precision, high-end, and fast turnaround products make us the best choice from startups to OEMs.


The company's PCB factory is currently located at:

Building #B2, Northern Industrial Park, Yanchuan Community, Songgang, Bao’an,Shenzhen,Guangdong,China.


The factory has a construction area of 10,000 square meters, a monthly production capacity of 20,000 square meters, and a monthly production range of up to 5,000 varieties.


As one ofChina's leading PCB manufacturers, SysPCB has a complete ISO9001, TS16949 quality control system and UL certification, sophisticated inspection equipment, company's hardware and software conditions provide a solid and reliable guarantee for the production of high-quality products.


The company is committed to providing a full range of high-quality PCB products, including single-sided boards, double-sided boards, multi-layer boards (up to 40 layers), aluminum substrates, heavy copper boards, high-frequency boards, HDI boards, Flexible boards, and Rigid-flex boards.


Express Delivery


24 hour turnaround time on double-sided PCB

2-4 days turn available up to 4~6 layers PCB

10 layers can be done in one week

To shorten the cycle time of new product introduction, lower costs and take initial market share.


Partners


SysPCB has over 2000 domestic and international customers, including Haier, Molex, and Omron from China; National Semiconductor of the United States, Microchip Technology of the United States, Siemens Medical of Germany, STMicroelectronics of Italy, National University of Singapore, and so on.


Products and Technology Application


SysPCB provides a comprehensive service manufacturing model, customer base spanning over 170 countries in Europe, North America, South America, the South Pacific, andAsia. The clients we serve mainly include high-tech fields such as industrial control, intelligent agriculture, healthcare, automobiles, security, university research, and intelligent consumer electronics.


Major quick service


1. Quotes turned in four hours or less on request

2. CRM system for customers in need of immediate access

3. Multinational, experienced professionals to provide technical customer service

4. Door-to-door service with international freight courier services


SysPCB provides one-stop service to meet technology challenges at the lowest cost. SysPCB will do its best to meet customer’s requirements, assist customers to shorten the time to market so as to improve their advantage.

We insist on paying attention to the needs and challenges of customers, provide competitive PCB products and services, and create maximum value for customers.


Data Communication PCB

Data Communication PCB

Layer count: 6

Board thickness: 2.4mm

Surface finish: ENIG

Min. line: 5mil

Min. hole: 0.2mm


Smartphone PCB

Smartphone PCB

Layer count: 10

Board thickness: 1.6mm

Surface finish: ENIG

Min. line: 4mil

Min. hole: 0.15mm


Below we use pictures and texts to show you the processing and manufacturing process of PCB boards:


1. Cut

Cut is the process of cutting the original copper clad laminate into a board that can be made on the production line.

First, let's understand a few concepts:

(1) Unit: refers to the unit graphics designed by PCB design engineers.

(2) Set: refers to the engineer in order to improve production efficiency, convenient production and other reasons, put together multiple “Unit” into a whole pattern. That is, we often call the panel, which includes unit graphics, process edges and so on.

(3) Panel: refers to a board that puts multiple “Set” together.


2. Inner dry film

The inner dry film is the process of transferring the inner line image to the PCB board.


In PCB production, we will mention the concept of image transfer, because the production of conductive graphics is the foundation of PCB production. Therefore, the image transfer process is of great significance to PCB production.

The inner dry film includes multiple processes such as attach inner film, exposure, developing, and inner layer etching. The inner film is to attach a special photosensitive film on the surface of the copper plate, which is what we call dry film. This film solidifies when exposed to light, forming a protective film on the board. Exposure developing is to expose the plate with a film attached, the light-transmitting part is cured, and the non-light-transmitting part is still dry film. Then, after developing, the dry film that has not cured is stripped, and the plate with the cured protective film is etched. After the film stripping, the line image of the inner layer is transferred to the board. The entire process flow is shown in the figure below.


Inner dry film


For designers, the main consideration is the minimum line width of the wiring, the control of the spacing and the uniformity of the wiring. Because the spacing is too small, the film will be sandwiched, and the film cannot strip clean and will cause a short circuit. The line width is too small, and the adhesion of the film is insufficient, resulting in an open circuit. Therefore, the safety spacing during circuit design (including line to line, wire to pad, pad to pad, wire to copper surface, etc.), all must consider the safety spacing during production.


(1) Pre-treatment: Grinding board


The main function of grinding board: mainly to solve the problem of surface cleanliness and surface roughness. Oxidation is removed, and the roughness of the copper surface is increased, so that the film can be adhered to the copper surface.


Grinding board

(2) Attach film


The treated copper clad laminate is hot-pressed or coated with dry or wet film to facilitate subsequent exposure production.


Attach film

(3) Exposure


Align the film with the copper clad laminate that has been pressed the dry film, and use ultraviolet light irradiation on the exposure machine to transfer the film image onto the photosensitive dry film.

Physical image of negative film

Physical image of negative film


Exposure


(4) Developing


Dissolve and rinse off the unexposed dry/wet film using the weak alkalinity of the developing solution (sodium carbonate), while retaining the exposed part.


Developing


(5) Etching


After the unexposed dry/wet film is removed by the developer, the copper surface will be exposed. The exposed copper surface will be dissolved and corroded by acidic copper chloride to obtain the required circuit.

Etching


(6) Stripping


Stripping off the exposed dry film protecting the copper surface with sodium hydroxide solution, expose the circuit pattern.

Stripping


3. Brown oxidation


Purpose: To form a micro rough and organic metal layer on the inner copper surface, enhancing the adhesion between layers.


Process principle:

By chemical treatment, a uniform and well adhesive organic metal layer structure is produced, which controls the coarsening of the copper layer surface before the inner layer is bonded, and is used to enhance the bonding strength between the inner copper layer and the semi cured sheet after pressing.


Brown oxidation


4. Lamination


Lamination is the process of bonding each layer of circuit into a whole using the adhesive properties of PP sheets. This bonding is achieved through the mutual diffusion and infiltration of macromolecules at the interface, resulting in interweaving. The discrete several plates and PP sheets are pressed together to form the required number of layers and thickness of multilayer board. During actual operation, materials such as copper foil, Polypropylene sheet (pp sheet), inner layer CCL, stainless steel, isolation plate (Kraft paper), outer layer steel plate, etc. shall be stacked according to the process requirements.


Lamination


For designers, the first consideration for lamination is symmetry. Because the board is affected by pressure and temperature during the lamination process, there is still stress in the board after the lamination is completed. Therefore, if the two sides of the laminated board are uneven, the stress on both sides will be different, causing the board to bend towards one side, greatly affecting the performance of the PCB.


In addition, even on the same plane, if the distribution of copper is uneven, it will cause the resin flow rate to be different at each point. This way, the thickness of the area with less copper will be slightly thinner, while the thickness of the area with more copper will be slightly thicker.


In order to avoid these issues, detailed consideration must be given to various factors such as the uniformity of the laying copper, the symmetry of the stacking layer, and the design layout of blind buried holes during the design.

5. Drill


Create through holes between the layers of the circuit board to achieve the purpose of connecting the layers.


Drill


Drilling bit

Drilling bit


6. Plated Through Hole & Panel Plating


(1) Plated through hole


Also known as chemical copper, the drilled PCB board undergoes an oxidation-reduction reaction in a copper vat, forming a copper layer that metallizes the holes, depositing copper on the surface of the previously insulated substrate, achieving interlayer electrical connectivity.


Plated Through Hole


(2) Panel Plating


Thicken the copper on the surface and holes of the newly coppered PCB board to 5-8um, to prevent the thin copper in the holes from being oxidized or slightly corroded before the pattern electroplating, and exposing the substrate.


7. Outer dry film

The process is the same as for the inner dry film.


Outer dry film


8. Pattern Plate

Add a certain thickness (20-25um) of copper plating to the hole and circuit copper layer to meet the requirements for the final PCB board copper thickness. Etch away the no use copper on the board surfaceto reveal useful circuit patterns.


9. Solder Mask


Solder mask, is one of the most critical processes in the production of printed boards, mainly through screen printing or coating of solder resistance ink, exposure and development, expose the pads and holes that will need to be soldered, other areas are covered the solder mask ink, in order to prevent short circuit during soldering.


10. Silkscreen

Silk screen print the required text, trademark, or part symbol on the surface of the circuit board.


Silkscreen


11. Surface Finishing


Bare copper itself has good solderability, but it is prone to moisture oxidation when exposed to air for a long time, and tends to exist in the form of oxides. It is unlikely to remain the original copper for a long time, so surface finishing of the copper surface is necessary. The basic purpose of surface finishing is to ensure good solderability or electrical performance.


Common surface finishing include OSP, HASL (Hot Air Solder Leveling), Immersion Gold, Immersion Tin, Immersion Silver, Gold-finger etc.


12. Final Shaping


Cut the PCB into the required external dimensions using a CNC molding machine.


Final shaping


13. Electrical Test


Simulate the state of the board, check the electrical performance when powered on, and check whether there is an open or short circuit.


14. Final inspection


Inspect the appearance, board size, hole size, thickness, and markings of the board to meet customer requirements.


Final inspection

15. Packaging

Packaging qualified boards for easy storage and transportation.

packaging