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The advantages of aluminum based PCB are environmentally friendly: aluminum is non-toxic and recyclable. Excellent heat dissipation: High temperatures can cause serious damage to electronic devices. Therefore, using materials that are conducive to heat dissipation is the correct choice.
Aluminum can effectively transfer heat from heating or critical components, minimizing any potential harmful effects on the circuit board. Durability: Aluminum can provide strength, toughness, and durability that glass fiber substrates cannot provide. Aluminum is a relatively hard material that can reduce the risk of accidental damage during production, processing, and daily use. Lightweight: Aluminum enhances the strength and elasticity of the product without adding extra weight.
The common aluminum substrate structure is as follows: the surface layer is the wiring layer, the middle layer is the insulation and thermal conductivity layer, which has good thermal conductivity, and the bottom layer is the aluminum base layer.
Easy to manufacture and cost-effective, with wiring directly etched onto the copper layer of the aluminum laminated board. Heat is efficiently transferred through this path.
By using two layers of wiring and insulation layers, it ensures effective heat conduction between the components and the aluminum substrate.
When the single-sided layout cannot meet complex requirements, the double-sided design allows heat to be transferred back and forth between the upper and lower layers, and insulation treatment is required at the via holes to prevent conductivity.
The advantages of aluminum based PCB are environmentally friendly: aluminum is non-toxic and recyclable. Excellent heat dissipation: High temperatures can cause serious damage to electronic devices. Therefore, using materials that are conducive to heat dissipation is the correct choice.
Aluminum can effectively transfer heat from heating or critical components, minimizing any potential harmful effects on the circuit board. Durability: Aluminum can provide strength, toughness, and durability that glass fiber substrates cannot provide. Aluminum is a relatively hard material that can reduce the risk of accidental damage during production, processing, and daily use. Lightweight: Aluminum enhances the strength and elasticity of the product without adding extra weight.
The common aluminum substrate structure is as follows: the surface layer is the wiring layer, the middle layer is the insulation and thermal conductivity layer, which has good thermal conductivity, and the bottom layer is the aluminum base layer.
Easy to manufacture and cost-effective, with wiring directly etched onto the copper layer of the aluminum laminated board. Heat is efficiently transferred through this path.
By using two layers of wiring and insulation layers, it ensures effective heat conduction between the components and the aluminum substrate.
When the single-sided layout cannot meet complex requirements, the double-sided design allows heat to be transferred back and forth between the upper and lower layers, and insulation treatment is required at the via holes to prevent conductivity.
