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The influence of rough gold plating
Decreased electrical performance: Rough surface of gold fingers can increase contact resistance, leading to increased attenuation in signal transmission and potentially causing data transmission error or unstable connection.
Reduced durability: rough surfaces are prone to accumulate dust and oxides
Accelerated the wear of the gold layer and reduced the lifespan of the gold fingers.
Mechanical performance damage: Uneven surfaces may scratch the contact points of the other party during insertion and extraction, affecting the tightness of the connection between both parties
In severe cases, it may result in the inability to insert or remove properly.
Decreased aesthetic appeal: Although this is not a direct issue with technical performance, the appearance of the product is also an important reflection of quality, and rough gold plating can affect customers' overall evaluation of the product.
In order to ensure the high performance and reliability of the Golden Finger PCB, the industry has established a series of strict acceptance standards, mainly involving the following aspects:
Gold plating thickness: Generally speaking, the gold plating thickness for gold fingers is required to be between 0.125 μ m and 5.0 μ m, with specific values depending on application requirements and cost considerations. Thin is prone to wear and tear, while thick is too costly.
Surface roughness: Ra (arithmetic mean roughness) is used as the measurement index, and the common acceptance standard is Ra ≤ 0.10 μ m. This standard ensures good electrical contact and durability.
Uniformity: The gold plating layer should be evenly covered without obvious spots, exposed copper, or bubbles to ensure consistent performance at each contact point.
Solderability and corrosion resistance testing: The corrosion resistance and long-term reliability of gold fingers are tested through methods such as salt spray testing and high temperature and high humidity testing.
The influence of rough gold plating
Decreased electrical performance: Rough surface of gold fingers can increase contact resistance, leading to increased attenuation in signal transmission and potentially causing data transmission error or unstable connection.
Reduced durability: rough surfaces are prone to accumulate dust and oxides
Accelerated the wear of the gold layer and reduced the lifespan of the gold fingers.
Mechanical performance damage: Uneven surfaces may scratch the contact points of the other party during insertion and extraction, affecting the tightness of the connection between both parties
In severe cases, it may result in the inability to insert or remove properly.
Decreased aesthetic appeal: Although this is not a direct issue with technical performance, the appearance of the product is also an important reflection of quality, and rough gold plating can affect customers' overall evaluation of the product.
In order to ensure the high performance and reliability of the Golden Finger PCB, the industry has established a series of strict acceptance standards, mainly involving the following aspects:
Gold plating thickness: Generally speaking, the gold plating thickness for gold fingers is required to be between 0.125 μ m and 5.0 μ m, with specific values depending on application requirements and cost considerations. Thin is prone to wear and tear, while thick is too costly.
Surface roughness: Ra (arithmetic mean roughness) is used as the measurement index, and the common acceptance standard is Ra ≤ 0.10 μ m. This standard ensures good electrical contact and durability.
Uniformity: The gold plating layer should be evenly covered without obvious spots, exposed copper, or bubbles to ensure consistent performance at each contact point.
Solderability and corrosion resistance testing: The corrosion resistance and long-term reliability of gold fingers are tested through methods such as salt spray testing and high temperature and high humidity testing.
