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Bare PCB

Bare Printed Circuit Board (BPCB) refers to a circuit board without any processing, protective layers, or components on electronic circuit connectors. That is to say, a bare circuit board is just a simple printed circuit board and does not have electrical performance.
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Types of bare circuit boards


Generally, bare circuit boards can be divided into three types: single panel, double-sided board, and multi-layer board. 


1. Single panel 

Single panel refers to a circuit board with only one side covered with copper and only one side chemically etched. Single panel is usually only suitable for simple circuits, so the manufacturing cost is relatively low. 


2. Double sided panel 

Double sided board refers to a circuit board with connected circuits on both sides that do not affect each other. Double sided panels are more suitable for complex circuits than single panel panels, but the manufacturing cost is also higher. 


3. Multilayer board 

Multilayer board refers to the process of laminating multiple single or double-sided boards, typically consisting of four or more layers. Multilayer boards not only have more complex circuits, but can also achieve smaller volumes, but they are also more expensive compared to double-sided boards and single panel boards.


Bare Printed Circuit Board (BPCB)

Production and manufacturing process of bare circuit board


1. Preliminary preparation


The preliminary preparation includes checking the raw materials (FR-4 or metal substrate), designing the network cable diagram of the circuit board, designing circuit board software, and mastering drawing skills.


2. Produce inner layer board


By cutting and stacking copper foil, an inner layer circuit board is obtained with a board thickness of 0.035-0.070mm.


3. Pattern exposure


Copy the silk screen network diagram onto the inner board, or export it using methods such as shielding film coating or etching.


4. Etching


Etch the circuit board in a controlled environment to remove unwanted metals and obtain the basic shape.


5. Outer panel production


Perform double-sided bonding, pressing, processing, and other operations on the processed inner panel.


6. Surface coverage


Cover the outer board with anti-corrosion and printing layers through spraying, printing, immersion plating, and other methods. The anti-corrosion coating is usually composed of welding film, shielding electrostatic film, semi-solid coating film or OSP film, etc.


7. High temperature drying


Arrange a well ventilated and clean drying room in the factory for high-temperature drying to densify the epoxy resin between the layers of the circuit board.


8. Final performance check


Inspect the circuit board by powering it on to ensure that it is functioning properly.


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