Capability of Components Assembly
|
|
Item
|
Mass production (mm)
|
Sample& Small order (mm)
|
|
SMT PCB
|
Length*Width
|
Min.
|
50*30
|
L＜50 Or W＜30
|
|
Max.
|
450*350
|
450＜L≤800 Or 350＜W≤400
|
|
Thickness
|
Min.
|
0.8
|
T＜0.8
|
|
Max.
|
5
|
T＞5
|
|
DIP PCB
|
Length*Width
|
Min.
|
50*30
|
L＜50
|
|
Max.
|
500*300
|
500＜L≤1000 Or 300＜W≤450
|
|
Thickness
|
Min.
|
0.8
|
T＜0.8
|
|
Max.
|
5
|
T＞5
|
|
Surface Mount Device
|
Size
|
Min.
|
0603（0201）
|
0402（01005）
|
|
Max.
|
45*45
|
45*45＜Size≤68*68（45*150）
|
|
Thickness
|
25.4
|
T＞25.4
|
|
QFP/SOP/SOJ/IC/Socket etc.
|
Min. PIN Distance
|
Pitch=0.4
|
Pitch=0.3
|
|
CSP、BGA
|
Min. Tin Ball Distance
|
Pitch=0.5
|
0.3≤Pitch＜0.5
|
|
PCB Type
|
FR4、FPC、Rigid-Flex PCB、Metal Core PCB
|
