Capability of Components Assembly |
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Item | Mass production (mm) | Sample& Small order (mm) | ||
SMT PCB | Length*Width | Min. | 50*30 | L<50 Or W<30 |
Max. | 450*350 | 450<L≤800 Or 350<W≤400 | ||
Thickness | Min. | 0.8 | T<0.8 | |
Max. | 5 | T>5 | ||
DIP PCB | Length*Width | Min. | 50*30 | L<50 |
Max. | 500*300 | 500<L≤1000 Or 300<W≤450 | ||
Thickness | Min. | 0.8 | T<0.8 | |
Max. | 5 | T>5 | ||
Surface Mount Device | Size | Min. | 0603(0201) | 0402(01005) |
Max. | 45*45 | 45*45<Size≤68*68(45*150) | ||
Thickness | 25.4 | T>25.4 | ||
QFP/SOP/SOJ/IC/Socket etc. | Min. PIN Distance | Pitch=0.4 | Pitch=0.3 | |
CSP、BGA | Min. Tin Ball Distance | Pitch=0.5 | 0.3≤Pitch<0.5 | |
PCB Type | FR4、FPC、Rigid-Flex PCB、Metal Core PCB |