1. What is a rigid-flex board?
Rigid-flex board refers to the combination of a flex board and a rigid board. It is a circuit board formed by combining a thin-layer flexible bottom layer and a rigid bottom layer, and then laminating it into a single component, It has the characteristics of being bendable and foldable. Due to the mixed use of various materials and multiple manufacturing steps, the processing time of rigid-flex boards is longer and the manufacturing cost is higher.
In electronic consumer PCBs, the use of rigid-flex boards not only maximizes space usage and minimizes weight, but also greatly improves reliability, eliminating the many needs for solder joints and fragile connections that can cause connection problems. Rigid-flex boards are also highly impact resistant and can survive high stress environments.
Rigid-flex boards are extremely versatile and are ideal for military, aerospace and medical equipment, and can also be used in medical equipment such as pacemakers to reduce their space and weight; at the same time, it is also widely used in various smart devices, test equipment, mobile phones, digital cameras and automobiles.
4 Layer Rigid-Flex PCB
IC carrier board is a technology developed with the continuous advancement of semiconductor packaging technology.
Like the rigid-flex board, the IC carrier board is a relatively high-end PCB board. It is developed on the basis of HDI board and has the characteristics of high density, high precision, miniaturization and thinning.
IC carrier board is also called packaging substrate. In the field of high-end packaging, IC carrier board has become an indispensable part of chip packaging. It not only provides support, heat dissipation and protection for the chip, but also provides electronic components between the chip and the PCB motherboard. The connection plays a role of "connecting the previous and the next"; even passive and active devices can be embedded to achieve certain system functions.
IC carrier board products are roughly divided into five categories: memory chip IC carrier board, MEMS IC carrier board, RF module IC carrier board, processor chip IC carrier board, and high-speed communication IC carrier board. They are mainly used in mobile smart terminals, service and storage etc.