The following is a brief introduction from China PCBA manufacturer-SysPCB, Let's take a look at the defects which can be detected by the SPI solder paste inspection.
1. Whether the solder paste printing is offset;
2. Whether the height of solder paste printing is deviated;
3. Whether the solder paste printing is bridged;
4. Whether the solder paste printing is blank or missing.
In SMT chip production, SPI solder paste inspection is one of the most important links. The inspection and judgment of the quality of the solder paste printing directly affect whether the mounting of the subsequent components meets the specifications.