Detailed explanation of relevant design parameters:
I. Via holes (commonly known as conductive holes)
1. Minimum aperture: 0.3mm (12mil)
2. The minimum via (VIA) diameter should not be less than 0.3mm (12mil), and the single side of the pad should not be less than 6mil (0.153mm), preferably greater than 8mil (0.2mm), but it is not limited. This point is very important and must be considered in the design.
3. Via hole (VIA) hole to hole spacing (hole edge to hole edge) can not be less than: 6mil preferably greater than 8mil This point is very important, the design must be considered
4. Pad to outline spacing 0.508mm (20mil)
II. Line
1. Minimum line spacing: 6mil (0.153mm). The minimum line spacing is line to line, and the distance from line to pad is not less than 6mil. From the perspective of production, the bigger the better, the general routine is 10mil. Of course, under the condition of the design, the bigger the better. This point is very important and must be considered during PCB layout.
2. Minimum line width: 6mil (0.153mm). That is to say, if the line width is less than 6mil, it will not be able to produce, (the minimum line width and line spacing of the inner layer of the multi-layer board is 8MIL) if the design conditions permit, the larger the design, the better, the larger the line width, the better the SMT factory produces, the higher the yield. General design routine is around 10mil.
3. Line to outline line spacing 0.508mm (20mil)
III. PAD
1. The outer ring of the plug-in hole (PTH) should not be less than 0.2mm (8mil) on one side. Of course, the bigger the better.
2. Plug-in hole (PTH) hole to hole spacing (hole edge to hole edge) can not be less than: 0.3mm, of course, the bigger the better.
3. The size of the plug-in hole depends on your components, but it must be larger than your component pins. It is recommended to be larger than at least 0.2mm or more, that is to say, if the component pins is 0.6mm. You must design at least 0.8mm, to prevent it difficult to insert,
4. Pad to outline spacing 0.508mm (20mil)
IV. Solder mask
1. The plug-in hole’s opening, and the single side of the hole ring cannot be less than 0.1mm (4mil)
V. Silkscreen
The design of the Silkscreen directly affects the production, whether the Silkscreen is clear or not is very related to the Silkscreen design. The Silkscreen width should not be less than 0.153mm (6mil), and the Silkscreen height should not be less than 0.811mm (32mil). The relationship between the width and height ratio is preferably 5. That is to say, the character width is 0.2mm and the character height is 1mm.
VI: Non-metallized slot holes
The minimum spacing of the slot holes is not less than 1.6mm, otherwise it will greatly increase the difficulty of edge milling
VII: Panelization
There is non gap panelization, and there is gap panelization. The gap of the PCB pieces should not be less than 1.6 mm (the thickness of the plate is 1.6 mm), otherwise it will greatly increase the difficulty of edge milling. The size of the panelization work board varies depending on the equipment. The gap of non gap panelization is about 0.5mm, and the process edge cannot be less than 5mm
