what are the causes of PCB board heating radiation problem, China PCB assembler SysPCB_

what are the causes of PCB board heating radiation problem

In assembled circuit boards, excessive temperatures can negatively affect the function, the components and the board itself. So, what are the causes of PCB board serious heating?

 

1, incorrect placement of components

Certain high-power devices need to be reserved for natural or forced ventilation to dissipate heat. Without proper airflow to dissipate heat, the PCB will accumulate most of the heat, resulting in higher temperatures, which can lead to reduced performance or damage to the circuit. Care should be taken not to place sensitive components near components that emit large amounts of heat; temperatures can be kept within safe limits through proper heat dissipation and natural or forced cooling.

 

2, environmental and external thermal factors

When using PCBs in extreme temperature environments, electronic components may subject to excessive stress if the temperature conditions in the target environment are not taken into account when designing PCB; generally, electronic component manufacturers provide specifications that apply within a specific temperature range.

 

3Miss selection of parts and materials

Failure to follow the recommended usage guidelines during the selection of materials for electronic components, may result in thermal problems.

 

When selecting electronic components, it is important to review detailed data sheet and consider all relevant information related to power consumption, thermal resistance, temperature limits, and cooling techniques.

 

Also, perform a quick power calculation on the resistors to ensure that the appropriate power rating is selected for the application. There is also the issue of PCB dielectric material selection, the printed circuit board itself must be able to withstand the worst-case thermal conditions.

 

4, PCB design and manufacturing defects

Poor layout and manufacturing processes can lead to PCB thermal problems. Improper soldering may hinder heat dissipation, and insufficient alignment width or copper area can also lead to higher temperatures.

 

To prevent thermal problems, designers must reduce heat dissipation and use other cooling techniques when natural cooling is inadequate; thermally optimized design requires attention to component specifications, PCB layout, PCB dielectric materials and environmental conditions.