The bill of material (Bill of Material, BOM) is a file that describes the product structure in a data format. The SMT processing BOM includes the material name, quantity, and placement position. The BOM is an important basis for surface mount system programming and IPQC confirmation.
DIP (Dual In-line Package) is also called dual in-line packaging technology, which refers to integrated circuit chips packaged in dual in-line form. Most small and medium-sized integrated circuits use this form of packaging, and the number of DIP components pins are generally no more than 100. The DIP packaged CPU chip has two rows of pins, which need to be inserted into the chip socket with the DIP structure.
It is called "Surface Mounted Technology" in English, and called SMT in short, which is a circuit assembly technology that mounts and solders surface mount components to a specified position on the surface of printed circuit board. Specifically, it is coat solder paste on the printed circuit board pad at first, then accurately place the components on the pads coated with solder paste, and heat the printed circuit board until the solder paste melts and then cools down. After that, the interconnection between the components and the printed circuit board is realized.
In the 1980s, SMT production technology became more and more perfect. The mass production of components used in surface mounting technology resulted in a significant drop in prices, various types of equipment with good technical performance and low prices appeared one after another. Electronic products assembled with SMT have the advantages of small size, good performance, complete functions and low price, so as a new generation of electron install technology, SMT is widely used in electronic products install in various fields such as aviation, aerospace, communications, computers, medical electronics, automobiles, office automation, household appliances, etc.
SMD is called surface mount devices. In the initial stage of electronic circuit board production, through hole assembly is completely finished manually. After the introduction of the first automated machines, they can place some simple pin components, but complex components still need to be manually placed to operate wave soldering.
Surface mounted components were introduced about thirty years ago, and this opened a new era. From passive components to active components and integrated circuits, they eventually become surface mounted devices (SMD) and can be assembled by pick-and-place equipment. For a long time, people believed that all pin components could eventually be packaged in SMD.