China PCB industry development under the changing situation
Printed circuit boards market developing in recent years
The recent status of Shenzhen PCBA SMT factory
Top 10 PCBA manufacturers in China
Taiwanese PCB output value creates the high record at first half year of 2021
China PCB industry reshuffle speeds up in 2021
What Is the Real Status of China PCB Industry?
Prototype and small volume PCB companies in China
Passive component prices increase under COVID-19 outbreaks in Malaysia and Philippines
Four major entry barriers in the PCB industry
History of PCB Development in China
China is still the SMT manufacturing center
New trend of the PCBA turnkey manufacturing market
Chinese CCL production capacity increase recent years
solution to the 32.768kHz crystal oscillator cannot oscillate
Challenge of energy conservation and environmental protection to the development of PCB
Limata's innovative LUVIR technology
Development prospect of LED plant lighting market
TPCA promotes PCB-ECI standardization
20H principle in PCB design
3W principle in PCB design
China's PCB output value will increase 2022
PCB equipment business prospects are promising
Automotive intelligence and electrification, PCB will obtain opportunity
Analysis of the reason why the pad is easy to fall off when the circuit board is soldered
Introduction to BGA Technology
What causes the print circuit board (PCB) trace open?
How to solve the problem of Rigid-Flex PCB expansion and shrinkage?
What will happen to the PCB industry in 2019?
2018 PCB Development Focus
PCBA circuit board Industry Recent Situation
2020 China SMT industry development situation
Evolution of THT plug-in process and SMT process
2015 PCB market grow slowly
Copper foil price rise 30% in few months
PCB factories facing upstream price rising
HDI and FPC growth fast in hot season
Japanese PCB industry consecutive 8months decline
AOI application in electronic manufacturing service
Parts placement precautions of double side reflow PCB
Analysis and improve of open defect in PCB
PCB panelization method
CCL and PCB price expected to increase
FPC new trend and application
Russia will Spurn AMD, Intel for Locally-Made Processors
Japan PCB industry 5months decline in 2016
Korean PCB industry in 2015&2016
Current challenges and opportunities of PCB chemicals
Taiwanese PCB industry grow slowly in 2016
HDI and FPC enable IoT
PCB factories are moving out from Shenzhen
Latest PCB industry China
High end PCB is popular in recent years
Nippon Mektron FPCB manufacturing supported Orbotech
Production capacity expanding raise PCB market concern
Choice for location of fiber glass factories
Fast development in East and South Asia PCB industry
Technical gap between Mainland China and Taiwan PCB industry
Deficiencies of small and medium China domestic PCB enterprises
Taiwan PCB enterprises into automotive PCB industry
Shenzhen to be the World’s PCB trading center
2015 Q3 Taiwan PCB production value released by TPCA
Moving in to inland regions, PCB industry pattern is changing in China
Challenge of PCB from Wearable electronics
Innovation in PCB manufacturing technology
Chinese PCB industry growth trend
2014 Global PCB output reach $60.2 Billion
Flexible PCB grow fast in Japan PCB industry
PCBA turnkey service is a New Trend in PCB manufacturers
Revolution SMT brings to Electronics
China Local PCB maker compete with Taiwan maker in HDI
Time to Build China PCB industrial Brand
Scanning the electromagnetic waves in printed circuit board
Develop trends in integrated circuit industry
PCB market growing in 2016
Impact of CNY Devaluation on China PCB industry
RF power Device market grow rapid in 2015
Advantage of SysPCB
HDI flexible pcb new trends in 2015
PCB Material Development
New material for flexible PCB
Express PCB Manufacturer
Taiwan PCB manufacturers expending, orders from China IT Company
Demands of mobile boards become weakness
PCB material supplier of high-frequency active layout of the front-end
ARLON high-frequency material
See through the design connotation of Aiptek’s pocket projector

Automotive intelligence and electrification, PCB will obtain opportunity

The automotive industry has developed to the present and is inseparable from our lives. In recent years, the concepts of new energy vehicles and unmanned driving are hot, and the traditional automobile industry is developing in the direction of intelligence and electrification. As an indispensable part of the car, the PCB (print circuit board) will undoubtedly be affected and the development of technology and products will change accordingly. The two booms of new energy vehicles and unmanned driving will bring many positive effects to the PCB industry. In the public impression, PCB circuit boards are more related to consumer electronics products, but with the increasing number of electronic components used in new energy vehicles, more and higher requirements are placed on PCB products, thus high-reliability PCB can get more opportunities. Through past experience in the military and medical fields, it is foreseeable that the boom in new energy vehicles will increase the reliability requirements of products.

Automotive Electronics, 5G will drive the development of PCB industry

The growth rate of smart phones, PC (personal computer)s and tablets has generally slowed down, and the consumer electronics products in the PCB market has weakened, resulting in a decline in demand for PCBs. In the future growth of the PCB industry, in addition to automotive electronics, 5G applications are also potential. Compared with the 4G era, the 5G era will change in transmission speed and application, which will greatly affect the future development of the consumer electronics industry. In 2019, the circuit board industry will usher in revolutionary innovations, from the use of materials, production technology to applications.

Give attention to both battery life and thinness, product thermal design requirements are high

Nowadays, mobile phone users are everywhere, the battery life has become one of the important considerations for consumers when purchasing mobile phones and other products. The pursuit of high-power products for electronic products is getting higher and higher, but mobile phones are developing towards thinner and lighter. What challenges will this contradiction bring to the industry?
First, the internal space of the product is getting smaller and smaller, and more specialized, smarter, and thinner chips and devices will be needed. However, such chips and devices may generate more heat during use, so at the design level, need better thermal design to meet higher power requirements.
Secondly, from the battery side, improving the battery life requires a better battery. In addition to the volume, the control and management of the battery can not be ignored, therefore, the battery energy management also needs a superior design.