China PCB industry development under the changing situation
Printed circuit boards market developing in recent years
The recent status of Shenzhen PCBA SMT factory
Top 10 PCBA manufacturers in China
Taiwanese PCB output value creates the high record at first half year of 2021
China PCB industry reshuffle speeds up in 2021
What Is the Real Status of China PCB Industry?
Prototype and small volume PCB companies in China
Passive component prices increase under COVID-19 outbreaks in Malaysia and Philippines
Four major entry barriers in the PCB industry
History of PCB Development in China
China is still the SMT manufacturing center
New trend of the PCBA turnkey manufacturing market
Chinese CCL production capacity increase recent years
solution to the 32.768kHz crystal oscillator cannot oscillate
Challenge of energy conservation and environmental protection to the development of PCB
Limata's innovative LUVIR technology
Development prospect of LED plant lighting market
TPCA promotes PCB-ECI standardization
20H principle in PCB design
3W principle in PCB design
China's PCB output value will increase 2022
PCB equipment business prospects are promising
Automotive intelligence and electrification, PCB will obtain opportunity
Analysis of the reason why the pad is easy to fall off when the circuit board is soldered
Introduction to BGA Technology
What causes the print circuit board (PCB) trace open?
How to solve the problem of Rigid-Flex PCB expansion and shrinkage?
What will happen to the PCB industry in 2019?
2018 PCB Development Focus
PCBA circuit board Industry Recent Situation
2020 China SMT industry development situation
Evolution of THT plug-in process and SMT process
2015 PCB market grow slowly
Copper foil price rise 30% in few months
PCB factories facing upstream price rising
HDI and FPC growth fast in hot season
Japanese PCB industry consecutive 8months decline
AOI application in electronic manufacturing service
Parts placement precautions of double side reflow PCB
Analysis and improve of open defect in PCB
PCB panelization method
CCL and PCB price expected to increase
FPC new trend and application
Russia will Spurn AMD, Intel for Locally-Made Processors
Japan PCB industry 5months decline in 2016
Korean PCB industry in 2015&2016
Current challenges and opportunities of PCB chemicals
Taiwanese PCB industry grow slowly in 2016
HDI and FPC enable IoT
PCB factories are moving out from Shenzhen
Latest PCB industry China
High end PCB is popular in recent years
Nippon Mektron FPCB manufacturing supported Orbotech
Production capacity expanding raise PCB market concern
Choice for location of fiber glass factories
Fast development in East and South Asia PCB industry
Technical gap between Mainland China and Taiwan PCB industry
Deficiencies of small and medium China domestic PCB enterprises
Taiwan PCB enterprises into automotive PCB industry
Shenzhen to be the World’s PCB trading center
2015 Q3 Taiwan PCB production value released by TPCA
Moving in to inland regions, PCB industry pattern is changing in China
Challenge of PCB from Wearable electronics
Innovation in PCB manufacturing technology
Chinese PCB industry growth trend
2014 Global PCB output reach $60.2 Billion
Flexible PCB grow fast in Japan PCB industry
PCBA turnkey service is a New Trend in PCB manufacturers
Revolution SMT brings to Electronics
China Local PCB maker compete with Taiwan maker in HDI
Time to Build China PCB industrial Brand
Scanning the electromagnetic waves in printed circuit board
Develop trends in integrated circuit industry
PCB market growing in 2016
Impact of CNY Devaluation on China PCB industry
RF power Device market grow rapid in 2015
Advantage of SysPCB
HDI flexible pcb new trends in 2015
PCB Material Development
New material for flexible PCB
Express PCB Manufacturer
Taiwan PCB manufacturers expending, orders from China IT Company
Demands of mobile boards become weakness
PCB material supplier of high-frequency active layout of the front-end
ARLON high-frequency material
See through the design connotation of Aiptek’s pocket projector

Innovation in PCB manufacturing technology

The innovation of the printed circuit, based on technology innovation has brought the revolutionary change to the PCB.
Printed circuit board (PCB) is indispensable to modern electronic equipment accessories, high-end electronic devices, almost all household appliances and electronic toys are load electronic components and electrical signals of PCB, the PCB is along with the development of the electronic information industry and the development.
Innovation of printed circuit boards, the first is that PCB product and market innovation. The earliest PCB products are single panel, with only a conductor layer on insulation board, line width in millimeters, are commercial used in semiconductor transistor radio. Later, along with the arrival of such as TV, computer, PCB product innovation, then a double panels, multilayer_, conductor layer or multilayer_ insulation board, line width is reduced gradually. In order to adapt to the electronic device miniaturization, lightweight development, flexible PCB was invented.
Because of PCB product innovation, we have a spring of printed circuit development. Smart phones will bring the boom of embedded components, PCB, LED energy-saving lighting will bring the boom of metal base printed circuit board, e-books and film display will bring the boom of the flexible circuit board.
Traditional PCB manufacturing technology is copper foil etching method, which uses copper-clad laminates applying chemical etching solution to remove unwanted copper layer, leave need copper conductor forming line graphics; for double sided and multilayer interconnection between the layers is implemented by drilling and electroplating copper conduction. Now the traditional process has been difficult to adapt to the micron grade fine lines HDI board production, it is difficult to achieve rapid and low cost production, is also difficult to achieve the purpose of energy conservation and emission reduction, green production, technical innovation is the only thing to change this situation.
High density change is an eternal subject of PCB technology. The characteristics of high density is more fine lines, and smaller interconnection hole, the higher number and thinner. For example,  Min. line width/space has refined from 100 to 75 microns, 50 microns by some high tech PCB manufacturers, a few years later, refinement can be 25 microns, 20 microns, therefore, reform the copper foil etching process is a good choice.
New path of innovation is electronic printed circuit (PEC), its products and technology has brought the revolutionary change to the PCB. Electronic printed circuit technology with pure printing method for electronic circuit graphics, namely USES the silk screen printing or offset printing or ink jet printing technology, the functional inks, conductive ink, ink semiconductor inks, insulation, etc. to print on the insulating substrate, the electronic circuit. The technology can simplify the production process, save raw materials, reduce the pollutant, reduce production cost, also it is a challenge for the traditional PCB manufacturers. After equipped with roll type (RolltoRoll) processing equipment, we can achieve mass production, low cost more. There small PCB printing machine in the market now. It is a solution choice for engineers who need a lot of PCB prototypes.