Innovation in PCB manufacturing technology

The innovation of the printed circuit, based on technology innovation has brought the revolutionary change to the PCB.
 
Printed circuit board (PCB) is indispensable to modern electronic equipment accessories, high-end electronic devices, almost all household appliances and electronic toys are load electronic components and electrical signals of PCB, the PCB is along with the development of the electronic information industry and the development.
 
Innovation of printed circuit boards, the first is that PCB product and market innovation. The earliest PCB products are single panel, with only a conductor layer on insulation board, line width in millimeters, are commercial used in semiconductor transistor radio. Later, along with the arrival of such as TV, computer, PCB product innovation, then a double panels, multilayer_, conductor layer or multilayer_ insulation board, line width is reduced gradually. In order to adapt to the electronic device miniaturization, lightweight development, flexible PCB was invented.
 
Because of PCB product innovation, we have a spring of printed circuit development. Smart phones will bring the boom of embedded components, PCB, LED energy-saving lighting will bring the boom of metal base printed circuit board, e-books and film display will bring the boom of the flexible circuit board.
 
Traditional PCB manufacturing technology is copper foil etching method, which uses copper-clad laminates applying chemical etching solution to remove unwanted copper layer, leave need copper conductor forming line graphics; for double sided and multilayer interconnection between the layers is implemented by drilling and electroplating copper conduction. Now the traditional process has been difficult to adapt to the micron grade fine lines HDI board production, it is difficult to achieve rapid and low cost production, is also difficult to achieve the purpose of energy conservation and emission reduction, green production, technical innovation is the only thing to change this situation.
 
High density change is an eternal subject of PCB technology. The characteristics of high density is more fine lines, and smaller interconnection hole, the higher number and thinner. For example,  Min. line width/space has refined from 100 to 75 microns, 50 microns by some high tech PCB manufacturers, a few years later, refinement can be 25 microns, 20 microns, therefore, reform the copper foil etching process is a good choice.
 
New path of innovation is electronic printed circuit (PEC), its products and technology has brought the revolutionary change to the PCB. Electronic printed circuit technology with pure printing method for electronic circuit graphics, namely USES the silk screen printing or offset printing or ink jet printing technology, the functional inks, conductive ink, ink semiconductor inks, insulation, etc. to print on the insulating substrate, the electronic circuit. The technology can simplify the production process, save raw materials, reduce the pollutant, reduce production cost, also it is a challenge for the traditional PCB manufacturers. After equipped with roll type (RolltoRoll) processing equipment, we can achieve mass production, low cost more. There small PCB printing machine in the market now. It is a solution choice for engineers who need a lot of PCB prototypes.