Revolution SMT brings to Electronics

Electronic surface mount components are attached directly to the printed circuit board (PCB). They are also known as SMT components (surface mount technology) or SMD (surface mount devices). These components can be either active or passive electronic components. Some of the types of components made in these surface mount configurations include: capacitors, inductors, resistors, semiconductors, and thermistors.
When we talk about compact, efficient and critical component of a wide variety of machines, automobiles, PLC, and other electronic devices, the first thing that comes in the view of everyone is the printed circuit board. PCBs have persistently evolved over many decades in the global electronics industry having unparalleled influence with the developing technologies and innovations.
Manufacturing such high quality PCB involves a lot of complexities and hence requires high end technology and services. There are many steps to be followed in order to design a PCB among which PCB prototyping service and assembly are quite important. With the development of technology, now days a popular assembly technique has been introduced which is well known to be Surface Mount Technology (SMT). With a vast development over earlier assembly techniques, this technology has set its standards in the market of electrical device designing.
Their smaller size is not without its drawbacks. Most of the surface mount components cannot carry as much power as the older thru-hole technology because of their smaller size. Sometimes the transformer or inductor must be mounted in a separate (usually by hand) process because they are too large to be tape and reeled. Hence these boards cannot be entirely populated by a pick and place machine.
All in all, however, the surface mount technology is how most components will be manufactured in the future. The call for power is decreasing, with the exception of specific applications, so the smaller size is not an issues for most computers, tablets, and cell phones. Going forward most components will be surface mount devices, if they are not already.