Multilayer board refers to a PCB which has more than three conductive pattern layers and is laminated with insulating materials between them. With the development of electronic technology to high-speed, multi-function, large capacity and portable low-consumption direction, the application of multi-layer PCB is more and more widely, and its layer number and density are also higher and higher, and the corresponding structure is also increasingly complex. The production of multilayer PCB has become the most important part of the whole PCB industry. At present, the average number of layers of SysPCB has reached 4~6layers, can up to 28 layers, which has reached a high level in terms of inner layer manufacturing ability and laminating ability. The emergence of multi-layer board technology is a major development of PCB industry, which makes the whole PCB technology advance by leaps and bounds.
High assembly density, small size, and lightweight is the advantage of multilayer PCB. Due to the high assembly density, the circuits between components (including components) is reduced, thereby improving reliability; more layers can be used, thereby increasing design flexibility; could design impedance control circuit; a high-speed transmission circuit can be formed; magnetic circuit shielding layer can be set, and a metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation; simple installation and high reliability.
The manufacturing of high-layer, high-difficulty, special materials, special process circuit boards, which has always been our characteristics, the continuous improvement of high-multi-layer circuit board manufacturing process as our goal.
Every year we invest a lot of human resources and material resources in production equipment and process research and development and try our best to catch up with the development of cutting-edge circuit board manufacturing technology.
SysPCB is committed to solving customers' pain points for difficult boards, precision boards, and special boards with nowhere to process, improving the high reliability of products, effectively avoiding process defects, and ultimately meeting customers' quality requirements.
I: CCL selection
The quality of raw materials directly affects the quality of printed circuit boards. Therefore, in order to improve the high reliability of HDI, the SysPCB strictly selects Shengyi A-level CCL, which provides a basic guarantee for product quality.
II: Press equipment
High-performance pressure machines can meet the accuracy and reliability of interlayer alignment of high-end boards. The SysPCB introduced the German BURKLE vacuum laminator and other supporting equipment to form a lamination line for high-precision multi-layer PCB lamination.
III. Drilling process
The traditional mechanical method can no longer meet the drilling requirements. SysPCB is equipped with superior processing capacity, improves productivity, achieves stable processing quality and high processing positioning accuracy.
For the multi-layer boards required by the market, the advantages of the SysPCB are as follows:
1. Up to 64 layers;
2. Back-drilling can reduce the loss of signal transmission;
3. Aperture ratio 15:1, plate thickness 0.4-10.0mm;
4. Blind hole technology, impedance control;
5. The alignment deviation between layers can be controlled within 35um;
6. Adopt a special design method - ventilation hole design to improve the bonding force between the copper layer and the hole wall.
7. In addition, our inner layer connection quality control method can improve the process parameters and special parameters, so as to improve the inner layer connection quality.
SysPCB continuously optimizes the process level and improves the manufacturing capacity, and is committed to providing customers with high-reliability multi-layer board manufacturing services.
Stand Process Flow for Multilayer PCB: /uploadfile/upload/file/20210402/20210402093603_79057.pdf
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8 Layer breakout main board 14 Layer Industrial Camera board
Board thickneess: 1.6mm Board thickness: 2.2mm
Layer count: 8 Layer count: 14
Surface treatment: ENIG Surface treatment: ENIG
Min. hole: 0.15mm Min. hole: 0.2mm
Min. Line: 3.9mil Min. Line: 0.1mm
Other: Impedance control, castled holes Other: High aspect ratio, 0.5mm pitch BGA
