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In the PCBA processing process, the PCBA board needs to be soldered multiple times to form a complete PCBA board. In a complete production process, soldering of the reflow oven, soldering of the wave soldering, and manual soldering of the soldering iron are required. The soldering temperature of the PCBA board is different according to different soldering processes.
General reflow soldering temperature is 240 ° C ± 5 (lead-free), 210 ° C ± 5 (lead); wave soldering temperature is 255 ° C ± 5 (lead-free), 230 ° C ± 10 (lead); The soldering iron has a soldering temperature in the range of 260 ° C to 300 ° C. Manual soldering time is generally no more than 3s, and no more than 2s for heat-sensitive components and chip components. If welding is not completed within the specified time, the solder joints should be re-soldered after cooling.
