Use HDI technology to produce smaller PCB

High-density interconnect (HDI) technology allows printed circuit board(PCB) designers to increase routing density, reduce layer count, and improve the thermal and electrical characteristics of their board designs.

PCB designers can create a product that is much smaller using blind and buried vias. PCB vias come in different configurations.

Through-hole (TH) vias originate and terminate at the outer layers of the PCB, while blind vias originate on an outer layer and terminate on an inner layer.

Buried vias are completely buried within the board, connecting only inner layers and not reaching the outer layers at all. Microvias are a form of blind vias that penetrate only one or two layers, and they have an extremely small drill hole (from 0.006 in./0.15 mm all the way down to 0.004 in./0.102 mm).

In addition to using microvias, blind vias, and buried vias, this technique requires careful electromagnetic interference (EMI) and thermal analysis, PCB layer stack up, and power/signal/ground distributions.

You’ll also need to be sure that when you place the ball-grid array (BGA) components that require decoupling capacitors that there is space for the capacitors on the locations underneath BGA packages.

With HDI Technology, electric products can achieve more function, weigh less and be physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed. The miniaturization of electronic products will bring a prosperous future to HDI manufacturing enterprise.

HDI PCB Structure