Precision PCB Fabrication, PCB Assembly, Components sourcing,  No MOQ...
You are here: Home » About Us » PCB Blogs » Knowledge » Through hole immersion soldering process

Through hole immersion soldering process

Inquire

facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
kakao sharing button
snapchat sharing button
sharethis sharing button

Previously, PCBA manufacturer SYS Tech introduced the use of shielding die wave soldering process and through-hole reflow soldering process in the PCBA through hole soldering process. Today we will introduce you the immersion soldering process.  


PCB immersion tin process


Using the selective immersion soldering process, the solder joints of 0.7mm~10mm can be soldered. For short pins and small-size pads, immersion soldering is more stable, and the possibility of bridging is small. The distance between the edges of adjacent solder joints, devices and soldering tips should be More than 5mm. Using the immersion soldering process, you can use the following parameter settings:  


① Soldering temperature 275℃~300℃

② Immersion speed 20mm/s~25mm/s  

③ Immersion time 1s~3s  

④ Speed after immersion 2mm/s  

⑤The shock pump rate is determined by the number of welding nozzles  


Table of Content list
Sign up for our newsletter

PCB Fab

PCB Assembly

Capabilities

CONTACT US
General Inquiry
Email: sales@syspcb.com
Phone: +86-0769-82201689
Fax: +86-0769-87799518

Tech Support
Email: tech@syspcb.com
Phone: +86-0769-82201689
SOCIAL NETWORKS
Copyright © 2024 SYS Technology Co., Ltd. All Rights Reserved.|Privacy policy|sitemap
We use cookies to enable all functionalities for best performance during your visit and to improve our services by giving us some insight into how the website is being used. Continued use of our website without having changed your browser settings confirms your acceptance of these cookies. For details please see our privacy policy.
×