Previously, PCBA manufacturer SYS Tech introduced the use of shielding die wave soldering process and through-hole reflow soldering process in the PCBA through hole soldering process. Today we will introduce you the immersion soldering process.
Using the selective immersion soldering process, the solder joints of 0.7mm~10mm can be soldered. For short pins and small-size pads, immersion soldering is more stable, and the possibility of bridging is small. The distance between the edges of adjacent solder joints, devices and soldering tips should be More than 5mm. Using the immersion soldering process, you can use the following parameter settings:
① Soldering temperature 275℃~300℃
② Immersion speed 20mm/s~25mm/s
③ Immersion time 1s~3s
④ Speed after immersion 2mm/s
⑤The shock pump rate is determined by the number of welding nozzles