Surface mounting compare to Through hole mounting

There are 2 main phases in PCB assembly: automated SMT assembly and manual through-hole assembly. SMT is a relatively newer and modern technique of making circuit boards which simplified the PCB manufacturing industry. It came after through-hole method of mounting. Take a look at how PCB surface mount manufacturing is different from its predecessor.

1. Surface mount has significantly helped in resolving the space issues which was common in through-hole. Now PCB designers are able to mount dense components on a smaller surface, making the product more compact.

2. Pin count in SMT products is more in comparison with its through-hole counterparts.

3. Components in surface mounting are leadless and so engineers can directly mount them over board surface. Previously, components had lead wires, need drilled of holes for insertion.

4. Previously components were bigger and hence had lower component density. SMT has more packing density and allows mounting on both sides.

5. Surface mounting has made some applications possible that were earlier impossible via through-hole method.

6. With the help of surface mounting technology, electronic businesses are able to achieve higher circuit speed because of reduced board size. This compliant with one of the major purposes required in marketing of electronic product, which is delivering high speed and small sized products.

This was a brief glimpse of how this new production technique is better than earlier methods. It is more advanced in terms of designing, skill, production and technology. Circuit board assembly is one of the most essential processes for the production of electronic products. with the rapid development of innovative technologies PCB manufacturers have also taken printed circuit board assembly a step ahead by introducing surface mount technology (SMT). All this could be possible only with this advanced technology namely SMT.