First, SMT basic process composition
Silk Screen (or Dispensing) > Mounting > (Curing) > Reflow Soldering > Cleaning > Detection> Rework Second, SMT production process
1. Surface Mount Technology
① Single-sided assembly: (all surface mount components on one side of the PCB)
Incoming material inspection - solder paste mixing - silk screen solder paste - mounting - reflow soldering
② Double-sided assembly: (surface mount components are on both sides of PCB)
Incoming material inspection - one side of PCB silk screen solder paste - mounting - reflow soldering - flip board - another side of PCB silk screen solder paste - mounting - reflow soldering - (cleaning) - inspection - rework
2. Mixed Mounting Technology process
① Single-sided mixed mounting technology process: (all insertion and surface mount components on one side of the PCB)
Incoming material inspection - solder paste mixing - silk screen solder paste - mounting - reflow soldering –insertion – wave soldering or dip soldering (a small number of insertion can be hand soldered) - cleaning - inspection - rework (first mounting and then insertion)
②Double-sided mixed mounting technology process A. (Surface mount components on one side of the PCB and insertion on the other side of the PCB)
Incoming material inspection - PCB one side silk screen solder paste – mounting - reflow soldering - flip board - PCB another side insertion - wave soldering (a small number of insertion can be hand soldered) - cleaning - inspection - rework
B. (Surface mount components on both sides of the PCB and insertion on either or both sides of the PCB)
First, the surface mount components of both sides of the double-sided PCB are reflowed by double-sided assembly, and then the two-sided inserts can be manually soldered.
