Selection of electronic components and CCL for PCBA

1. Selection of electronic components

The selection of electronic components should comprehensively consider the actual requirements of PCBA products, and try to use basic electronic components as much as possible, and for cost down consideration, avoid small-size electronic components; for IC devices should pay attention to the pin shape and pin spacing; for QFPs with a pin spacing of less than 0.5mm, consideration should be given to devices that are directly packaged in BGA.

In addition, SMT chip processing should fully consider factors such as the packaging form of electronic components, PCB solderability, reliability of SMT mounting, and temperature tolerance. After selecting the electronic components, an electronic component database must be established, which contains relevant information such as installation dimensions, pin dimensions, and SMT manufacturers.

2. The use of materials

The selection of CCL substrate for SMT processing should be based on PCB's application conditions and mechanical and electrical performance regulations. According to the PCB structure, determine the number of copper-clad surfaces of the substrate (single-sided, double-sided or multilayer); determine the thickness of the substrate according to the PCB size and the quality of electronic components per unit area. When selecting PCB substrates, in addition to price and other factors, factors such as electrical performance requirements, Tg value (glass transition temperature), CTE, and flatness should be taken into consideration.