The surface mount technology SMT, based on light, small, thin-film components and automated installation, is setting off a technological revolution in the entire electronics industry with a brand-new attitude. The application of chip components in electronic products has been further popularized, and its maintenance and welding technology has long been the content of the attention.
There are generally four types of surface mounting: single-sided pure chip component mounting, double-sided pure chip component mounting, single-sided chip components and through hole components mixed, double-sided chip components and through hole components mixed. The shape of the pad on PCB has an important influence on the strength and reliability of the soldering joints. The basic requirements are:
1. The center distance between adjacent pads of the same component should be equal to the center distance between the corresponding pins;
2. The width of the pad is equal to the width of the lead or welding head plus a constant, and the value can be adjusted in practice;
3. The length of the pad depends on the height and depth of the welding head or pin.
Generally speaking, the length of pad is more important than the width of pad.