Monitoring the quality of SMT placement process

With the development and progress of science and technology, better and more efficient methods are constantly being created by people. Today, automated production has become more and more popular. At the same time, with the rapid development of automation, the SMT manufacturing industry is constantly developing and producing simpler and more automated soldering inspection equipment.

The following is the monitoring of the quality of the placement during the SMT placement process, the printed circuit boards after the placement must be inspected, at least the following items must be spot-checked:

1. The location of the components

1) The location of components refers to the quality standard IPC-610-D for SMD components on printed circuit boards.

2) Components whose positions are not within the specified tolerance limits must be removed with a solder suction device; manual correction of component positions is not allowed.

3) The cause of the defect must be ascertained and corrective measures must be taken.

2. Missing components

Missing components are not allowed to be manually subsidized to the circuit board. The cause of the defect must be ascertained and corrective measures must be taken.

3. Impurities, scattered components

Impurities and scattered components must be removed from the printed circuit board with a tin sucker. The cause of the defect must be ascertained and corrective measures must be taken.

4. Damaged components

Damaged components must be removed. The cause of the defect must be ascertained and corrective measures must be taken.

5. Reuse of components

The components sorted out from the placement machine are not allowed to be reused.

6. Quality control

1) The quality control staff shall conduct a detailed audit of each step of the placement process:

2) Equipment maintenance and identification status must be recorded;

3) All operations must follow installation regulations and ESD instructions;

4) After the line transformation, the first board is 100% visually inspected to confirm whether the placement has defects such as wrong part, missing, misalignment, tombstone, etc.;

5) Whether there are scattered components on the component workbench and conveyor belt.

7. Regulations on the use of production raw materials related to the process

1) Follow the rules for the use of cleaners and grease;

2) Follow the hazardous material regulations of the adhesive.