Automated production has become more and more popular. At the same time, with the rapid development of automation today, the SMT manufacturing industry is constantly developing and producing simpler and more automated soldering and inspection equipment. Today Shenzhen China PCBA factory SYS Tech will introduce you the SMT machine.
SMT placement machine is a systematic project, a comprehensive technology involving a wide range of aspects, in the selection of printed boards, design specifications, production processes, placement methods, equipment process selection, SMT placement machine program compilation etc. Among them, whether the equipment selection and configuration are consistent with the production process is a sign of a SMT chip processing production line and management level.
SMT placement machine
First, The concept of component placement
When the solder paste printing is completed, the next step is to mount the SMT parts on the surface of the PCB, and then form an electrical connection between the parts and the PCB through reflow soldering. SMT parts are loaded into the special feeder (FEEDER) of the placement machine, then sucked by the nozzle (NOZZLE) of the placement machine, and accurately placed onto the PCB through the control of the pre-completed placement program, complete the placement of SMT parts.
Second, the key control points of component placement
Component placement is a process after solder paste printing. The purpose is to accurately place various components on the printed circuit board to ensure that there will be no wrong materials, missing parts, reverse polarity, position shift, component damage etc. after the subsequent process of reflow soldering. The placement process is the core part of SMT, the process capability of the placement machine and standardized quality control are important factors to ensure the quality of the final PCBA product.
In order to ensure quality, in addition to the correct machine parameter settings, special understanding and attention should be paid to: the maintenance of the placement machine, the monitoring of placement quality, and the identification and analysis of characteristic defects.
If there is dust or other small foreign objects on the reflective paper of the suction nozzle, the brightness of the image obtained from the camera will be reduced. If the reflected light brightness drops, a correct image cannot be obtained in the process of visual checking. Therefore, the image processing error and the accuracy of the machine will decrease. You can use a soft cloth or paper to gently wipe the nozzle.
Note: Do not wipe the reflective surface with a dirty cloth, as this will cause image problems. If the foreign matter is difficult to remove, replace the reflective surface.
Third, Rejected chip box and scrapped belts box
1. Rejected chip box
Components deemed defective by the image processing system or components that are not placed will be thrown in the rejected chip box. Check the box and remove the rejected material from time to time. The condition of the machine can be judged by the inspection of the thrown material, whether the program is written correctly, whether the components are good, how is the vacuum of the machine etc.
2. Scrapped belts box
A large number of waste belts are generated every 8 hours of production, so the waste box must be cleaned every 8 hours. If it is not cleaned up in time, the space of the waste box will be occupied, the waste material will be scattered on the machine, which will cause insufficient vacuum and the components will be poorly sucked.
