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Introduction of Aluminum copper clad

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Aluminum copper clad is a metal circuit board materials, composed with copper foil, insulation layer and metal substrate, its structure can be divided into three layers:

Circuit layer: same with general PCB CCL, copper foil thickness could be 1oz to 10oz.

Insulation: insulation layer is a layer materials with low thermal resistance, thickness from 0.003 "to 0.006”, is the key technology of aluminum core board,

Circuit layers (copper foil CCL) is usually formed after printed circuit etching, which can make each components connected. In general, the circuit layer requires a great currency loading ability, that needs thicker foil, usually 35μm ~ 280μm.


Aluminum PCB base material


Insulation layer is the core point of PCB aluminum board. It is usually filled by a special ceramic special polymer, with feature of thermal resistance, excellent viscoelastic properties, heat resistant and aging-resistant, could withstand mechanical and thermal stresses. Insulation layer of IMS-H01, IMS-H02, LED-0601 and other high-performance aluminum PCB use such technology, which enable it with an extremely excellent thermal properties and high electrical insulation strength.

Metal substrate is the support part of aluminum board, which requires a high thermal conductivity. Usually use aluminum core, sometimes also copper core (copper core pcb can provide better thermal conductivity), suitable for drilling, punching, cutting and other conventional machining. Compared with other PCB material, it has its own advantages, suitable to SMT surface mount assembly process, no radiator, much smaller, excellent heat dissipation, good insulation properties and mechanical performance.


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