Flexible circuit board market opportunities

Flexible Print Circuit (FPC) is a flexible copper foil substrate, which is etched and then processed to leave the desired wiring to serve as a medium for the transmission of electronic product signals. The flexible circuit board is mainly composed of an insulating substrate, an adhesive, and a copper foil conductor. After the wiring is completed on the flexible circuit board, a coverlayer film must be added on it to prevent the copper wire from being oxidized, protect the circuit from deterioration caused by environmental temperature and humidity.

As the flexible circuit board is light, thin, and has good reliability etc. characteristics, the earliest in the 60’s began to gradually replace traditional electronic circuits, and the United States applied them to aerospace and military applications etc. uses. Since the late 1970s, Japan gradually applied flexible circuit boards to consumer products such as calculators, cameras, car stereos, and printers etc. products. After the 1990s, with the emphasis on light weight and thin design for portable consumer electronic communication products, opening new opportunities for flexible circuit boards, including mobile phones, PADs, and laptops are their main application markets.

Rigid-flex Circuit Board application in notebook computers

Application of Flexible Circuit Board in Optical Drive

Application of Flexible Circuit Boards in Folding Mobile Phones

Mobile phone is the main growth driver for flexible circuit boards in the future

Currently, 30% of flexible circuit boards are used in the mobile phone field, about 10% are used in hard drives, and other fields include NB and LCD industries. In the future, mobile phone industry will continue to be the most promising market for flexible circuit boards under the trend of thin and light mobile phone designs, integrated multimedia and multi-functional media information platforms. In addition, LCD display industry lightweight and thin trend, flexible circuit board reliability requirements are relatively higher, it is also a market for flexible circuit board operators can not be underestimated. In summary, lightweight, high-density material technology will be the main development goals and directions of the flexible circuit board in the future.