defect in PCBA manufacturing

1. Poor contact angle of solder joints: the wetting angle between the fillet weld and the end joint of the land pattern is greater than 90°.   

2. Upright: One end of the component leaves the pad and stands upright or obliquely upward.   

3. Short circuit: the solder between two or more solder joints that should not be connected is connected, or the solder of the solder joint is connected with adjacent wires.   

4. Empty soldering: the component leads and the PCB solder joints are not connected by soldering.   

5. Pseudo soldering: The lead pins of the components and the PCB solder joints seem to be connected, but they are not actually connected.   

6. Cold welding: The solder paste at the solder joints is not completely melted or metal alloys are not formed.   

7. Less tin: The area or height of tin consumption between the component end and the PAD does not meet the requirements.   

8. Too much tin: The area or height of the component end and the PAD that eat tin exceeds the requirement.   

9. The solder joints are black: the solder joints are black and dull.   

10. Oxidation: The surface of components, circuits, PAD or solder joints occurred chemical reactions and colored oxides.   

11. Shifting: The component deviates from the predetermined position in the horizontal (horizontal), vertical (vertical) or rotational direction in the plane of the pad (based on the centerline of the component and the centerline of the pad).   

12. Polarity reversal (reverse): The direction or polarity of the component with polarity is inconsistent with the requirements of the document (BOM, ECN, component location diagram, etc.).   

13. Floating height: There is a gap or height between the components and the PCB.   

14. Wrong parts: the component specifications, part number, parameters, shape and other requirements are not consistent with (BOM, samples, customer information, etc.).   

15. Tin tip: The solder joints of the components are not smooth, and the tip is kept.   

16. Multiple pieces: According to BOM and ECN or sample board, etc., there are components on place where parts should not be installed or there are extra parts on the PCB.   

17. Missing parts: According to BOM and ECN or sample board, etc., the parts that should be installed on the position or on the PCB, but parts are missing.   

18. Dislocation: The position of the component or component pin is moved to the position of other PAD or pin. 1  

19. Open circuit (open circuit): PCB circuit disconnection.   

20. Side placement (side stand): The chip components with different width and height are placed on the side.   

21. Inverted white (turned side): components with two symmetrical surfaces are assembled by wrong side (such as: the side with silk-screen logo and the surface without silk-screen logo are upside down), commonly happen on chip resistors.   

22. Tin beads: small tin beads between the feet of components or outside of the PAD.   

23. Air bubbles: There are air bubbles inside solder joints, components or PCB.   

24. Tinning (climbing tin): The height of the solder joints of the components exceeds the required height.   

25. Tin crack: The solder joint is cracked.   

26. Hole plugged: PCB plug-in hole or via hole is blocked by solder or other.   

27. Damage: cracks or cuts or damages in components, board, copper foil, circuits, through holes, etc.   

28. Blurred silk screen: The text or silk screen of the components or PCB is fuzzy or broken, which can not be recognized or blurred.   

29. Dirty: The board surface is not clean, there are foreign objects or stains and other defects.   

30. Scratches: PCB or buttons are scratched and copper foil is exposed.   

31. Deformation: The components or PCB body or corners are not on the same plane or bent.   

32. Blistering (delamination): PCB delaminating, and there is a gap inside PCB layers.   

33. Overflowing glue (too much red glue) or overflowing the required range.   

34. Little red glue (too little amount of red glue) or not up to the required range.   

35. Pinhole (concave): PCB, PAD, solder joints, etc. have pinhole concavities.   

36. Burr (over the peak): PCB board edge or burr exceeds the required range or length.   

37. Impurities of gold finger: There are abnormalities such as pitting, tin spots or solder mask on the surface of gold finger plating.   

38. Gold finger scratches: There are scratch on the surface of the gold finger or marks bare copper exposing on Gold fingers.