First, the product adapts to the development of new assembly materials;
Second, the product assembly adapts to new surface assembly components;
Third, it is suitable for new assembly forms such as high-density assembly, three-dimensional assembly, and micro-electromechanical systems.
Fourth, SMT technology has many varieties of modern electronic products, update fast features to adapt. The details are as follows:
The installation orientation of the SMT is extremely strict, and the special assembly process technology such as the accuracy requirement is also thecontent that needs to be studied in the future period.
2. With the fine pitch of the component pins in the SMT process, the micro-assembly technology of 0.3mm pin pitch in the processing technology has become mature, and at the same time, it is developing in the direction of improving the quality of assembly and improving the pass rate of one assembly.
3. SMT process is now planned as the main content to be studied in the next period in order to adapt to high-density assembly and three-dimensional assembly.
Four low: low transaction costs, low difficulty in business negotiations, low threshold for order quantity, low unit price.
Four high: high degree of automation, high software output efficiency, high data analysis ability, high product yield.