printed wiring board

Shenzhen is home to over 500 PCB enterprises, predominantly small and medium-sized companies. However, increasing environmental standards have prompted about 80% of these companies to consider relocating, primarily for capacity expansion. While many PCB firms previously moved out of Shenzhen in 2007, the current trend is driven by the need for improved production capabilities. The electronic information industry, which constitutes over 90% of Shenzhen's high-tech output, heavily relies on PCBs as foundational components. Despite its significance, the PCB industry faces challenges such as lack of core technology, low-value products, and operational difficulties related to land, electricity, and rising costs. Key relocation destinations include Jiangxi, Chongqing, and Chengdu, chosen for their geographical advantages, development in electronic information, and relatively lenient environmental standards. Read More

The current PCB market is experiencing less pronounced effects from the peak season compared to previous years, prompting manufacturers to lower prices to secure orders. Taiwanese PCB makers are particularly focused on the declining sales of Apple's iPhone and iPad, leading to reduced orders for Apple contract factories, which even shut down earlier for the Lunar New Year. Tripod Technology reported a capacity utilization rate of about 80% in September, lower than the typical 90% during peak months. The expansion of production capacity by over 2 million feet in the fourth quarter raises concerns about increased competition and potential price wars among manufacturers. In response, some PCB factories are shifting their focus to the automotive electronics sector, aiming to capitalize on the growing demand for self-driving cars. Read More

A solder mask, also known as "solder resist," is a semi-transparent polymer layer applied to PCBs to protect copper traces and prevent short circuits by stopping conductive solder from bridging different components. Traditionally green, solder masks are now available in various colors. The green color’s origin is widely debated, with theories ranging from military standardization to the ease of working with green during assembly. Historically, solder masks used a mix of resins that produced unattractive hues like brown and yellow. By combining pigments, specifically blue and yellow, manufacturers eventually created the green shade, which became the industry standard due to its aesthetic appeal and compatibility with base laminates. Read More

The PCBA manufacturing fee is not a standardized measure for evaluating electronic manufacturing factories, as it varies based on each factory's cost structure and operational conditions. While low fees might indicate reduced manufacturing costs, they can lead to low-quality products, negatively impacting customer experience. Some manufacturers may initially offer low prices to build reputation but eventually increase fees once established. Conversely, certain factories maintain higher fees due to recognized quality and customer loyalty. However, some disreputable manufacturers rely on misleading pricing strategies to attract one-time customers without fostering repeat business. To find a trustworthy electronic manufacturing partner, visiting the factory for a direct assessment is recommended, rather than solely relying on pricing. Read More

Special holes such as countersink and counterbore holes are often needed in PCBs for mechanical purposes. A countersink hole is cone-shaped and used to allow screws to sit flush with the surface, while a counterbore hole is flat-bottomed for bolts or cap head screws. PCB manufacturers require specific information for both types of holes, including the major diameter, depth, shaft diameter, side of the board, and whether the hole should be plated or non-plated. Countersink holes also require the drill angle, while counterbore holes have parallel sides and do not need angle specification. Read More

Vias are crucial for signal routing in PCBs, connecting different layers to manage high-density interconnections. There are three types of vias: through vias, blind vias, and buried vias, with blind vias being laser drilled. Vias introduce parasitic capacitance, inductance, and impedance, impacting signal integrity, especially in high-speed circuit designs. To minimize issues, avoid unnecessary vias, remove unnecessary pads, and ensure balanced via usage in differential traces. Power vias, unlike signal vias, can be a bottleneck for current capacity. For thermal management, increasing via plating thickness, pad size, and using multiple small vias can improve thermal performance. However, buried or blind vias have higher thermal resistance compared to through vias. Read More