Completed PCB layout by steps This text outlines the key steps involved in the PCB design and manufacturing process. It starts with schematic PCB capture using an electronic design automation (EDA) tool, followed by determining board dimensions, fixed components, and heat sinks. The number of stack layers is decided based on design complexity, with attention to ground, power, and signal planes. Line impedance is calculated using factors like dielectric layer thickness and trace width, considering options like microstrip and stripline for signal routing. Component placement takes thermal considerations into account, and signal traces are routed to optimize EMI performance. Finally, Gerber files are generated for PCB manufacturing, with a recommendation to find a cost-effective manufacturer in China.
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