Through vias

To minimize PCB costs, several factors must be considered. The size of the PCB is crucial; smaller boards typically cost less, and following standard sizes can reduce costs further. Surface-Mount Technology (SMT) is less expensive than Through-Hole Technology (THT) due to its more compact design. However, dense component placement requires finer wiring, advanced materials, and careful design to avoid performance issues, which can increase costs. Read More

High Density Interconnection (HDI) PCBs are a rapidly growing technology in the PCB industry, offering higher circuitry density compared to traditional PCBs. There are three types of vias in HDI PCBs: through vias (surface to surface), blind vias (surface to inner layer), and buried vias (inner layer to inner layer). HDI boards require advanced manufacturing processes such as laser drilling, sequential lamination, and Via in Pad Technology, where vias are filled and plated over with copper. This technology allows for a reduction in the number of layers in PCBs while maintaining or improving functionality, making electronic products more compact, lighter, and more efficient. Read More