Advantages and disadvantages of flying probe test This document discusses the critical issue of electrical opens in PCBs, particularly during the flying probe test, and highlights key factors that can cause these issues, including PCB warping, soldermask, and silkscreen problems. Warping can occur if the hot air leveling process is skipped, leading to potential pseudo opens during testing. Soldermask blockage of through holes can result in open circuits, necessitating careful consideration when designing the testing net for flying probes. Silkscreen misalignment or low precision can cover pads and holes, leading to false open detections during E-testing. For PCBs with fine pads, small via holes, and high-density lines, it is recommended to perform electrical testing before applying the silkscreen. The document also outlines the pros and cons of flying probe testing, noting that while it avoids the cost of an E-test fixture, it is slow, can damage test pins, and is not suitable for high-voltage testing of multilayer PCBs.
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